components

Video Project Development in the Midst of an Impromptu Online Semester

Video Project Development in the Midst of an Impromptu Online Semester

Receiving robot parts in the mail was an unexpected conclusion to the Winter 2020 semester for students. However, when faced with a unique situation, innovative solutions were required, and the instructors of EECS 373: Introduction to Embedded System Design rose to the challenge. With the sudden transition to online learning in March due to the […]

Video Project Development in the Midst of an Impromptu Online Semester Read More »

WORLD’S FIRST MOS FET RELAY MODULE “G3VM 21MT” WITH SOLID STATE RELAY IN “T TYPE CIRCUIT STRUCTURE”

WORLD’S FIRST MOS FET RELAY MODULE “G3VM-21MT” WITH SOLID STATE RELAY IN “T-TYPE CIRCUIT STRUCTURE”

OMRON Corporation of Kyoto, western Japan globally released its new MOS FET (*1) relay module “G3VM-21MT” on December 2, 2019. The product is the first electronic component in the world (2) to adopt a “T-type circuit structure” (3). With a T-type circuit structure consisting of compact-size and longer-lifecycle solid-state relays that output signals using no physical contact, the relay

WORLD’S FIRST MOS FET RELAY MODULE “G3VM-21MT” WITH SOLID STATE RELAY IN “T-TYPE CIRCUIT STRUCTURE” Read More »

TEXAS INSTRUMENTS TPSM846C24 HIGH DENSITY STEP DOWN POWER MODULE

TEXAS INSTRUMENTS TPSM846C24 HIGH-DENSITY STEP-DOWN POWER MODULE

Texas Instruments TPSM846C24 35A Power Modules offer a fixed frequency and incorporate the controller, power MOSFETs, inductor, and associated components into a thermally enhanced, surface-mount package. To set the operating parameters of the module, the user supplies the input and output capacitors as well as a few other passive components. A two-phase power solution can be achieved

TEXAS INSTRUMENTS TPSM846C24 HIGH-DENSITY STEP-DOWN POWER MODULE Read More »