TDK INVENSENSE MOD-CH101 ULTRASONIC TOF SENSOR MODULE
Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, is now stocking the MOD_CH101 ultrasonic time-of-flight (ToF) sensor module and DK-CH101 SmartSonic™ platform from InvenSense, a TDK Group company. The ToF solutions offer fast and accurate range measurement with ultra-low power consumption, and are capable of detecting objects of any size, color, and transparency. The highly accurate devices are suitable for a range of applications including Internet of Things (IoT) devices, augmented reality, drones, and mobile devices.
The InvenSense MOD_CH101 ultrasonic ToF sensor module enables rapid integration of the Chirp CH-101 sensor. The CH-101 is a highly integrated system-in-package featuring an ultra-low-power system-on-chip (SoC) together with a piezoelectric micro-machined ultrasonic transducer. Built using patented MEMS technology from Chirp, the CH-101 operates advanced ultrasonic DSP algorithms and provides accurate range measurements to targets at distances up to 1.2 m. The MOD_CH101 module includes an acoustic housing that allows engineers to customize the sensor’s field of view (FoV) up to 180 degrees and allows for simultaneous range measurements to multiple objects within the FoV. The device is also immune to ambient noise.
The InvenSense DK-CH101 SmartSonic platform, now available to order from Mouser Electronics, includes an on-board CH-101 sensor and a Microchip SAM G55 microcontroller with an Arm® Cortex®-M4 core. The robust development board is capable of connecting up to four external MOD-CH101 sensor modules via flat-flex cables. Featuring an onboard embedded debugger, the platform can debug the SAM G55 without requiring external solutions. The DK-CH101 SmartSonic platform includes a comprehensive set of software tools, including embedded drivers, a GUI-based development tool, and SonicLink™ (available for download to registered developers).