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LENOVO OPEN SOURCE RK3399 BASED AM5708 SBCS

LENOVO OPEN SOURCE RK3399 BASED AM5708 SBCS

Lenovo has recently ventured into the community-backed SBC market, flagging off with a Rockchip-based board. They follow suit with fellow PC makers Asus. Their flagship Leez P710 boasts a more powerful, hexa-core Cortex-A72 and -A53 Rockchip RK3399 than that of the Asus Tinker Board’s RK3288. The Leez P710 was announced last February at Mobile World Congress and has been launched on AliExpress for $141.

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TURN YOUR SMARTPHONE TO A DSLR WITH THE PICTAR PRO

TURN YOUR SMARTPHONE TO A DSLR WITH THE PICTAR PRO

Mobile photography is fast growing beyond a hobby or a way for people to capture important moments. Thanks to the week-on-week breakthroughs and improvements being made on the camera by the phone manufacturers, it is now becoming a mainstream method of documenting visual information, with both professionals (from Journalists to Magazine Photographers) and Semi-professionals (like

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NVIDIA JETSON XAVIER NX SOM DELIVERS UP TO 21 TOPS FOR AI WORKLOADS AT THE EDGE

NVIDIA JETSON XAVIER NX SOM DELIVERS UP TO 21 TOPS FOR AI WORKLOADS AT THE EDGE

NVIDIA has just announced Jetson Xavier NX system-on-module, with the company claiming it is the “world’s smallest, most powerful AI supercomputer for robotic and embedded computing devices at the edge” with a 70x45mm “Jetson Nano” form factor, and delivering either up to 14 TOPS at 10 Watts or 21 TOPS at 15 Watts. The Jetson Xavier NX

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WAFER LEVEL CAMERA MODULE MEASURES ONLY 0.65 X 0.65 X 1.158MM

WAFER-LEVEL CAMERA MODULE MEASURES ONLY 0.65 X 0.65 X 1.158MM

OmniVision Technologies has released a fully packaged, wafer-level camera module measuring just 0.65×0.65mm and 1.158mm tall. Built around the company’s Guinness World Record breaking image sensor, only 0.575mm by 0.575mm, the OVM6948 CameraCubeChip was developed as a disposable medical imager, preventing cross-contamination risks while providing deeper anatomical access without being too invasive. OmniVision Technologies, Inc., a

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TORADEX ANNOUNCES ITS APALIS SOM BASED ON THE NXP I.MX 8QUADMAX APPLICATIONS PROCESSOR

TORADEX ANNOUNCES ITS APALIS SOM BASED ON THE NXP I.MX 8QUADMAX APPLICATIONS PROCESSOR

Toradex, a leader in embedded computing, announced today general availability for its Apalis System on Module (SoM) based on the NXP¼ i.MX 8QuadMax applications processor. The SoM has been available as part of Toradex’s ‘early access’ program to its key partners and customers for several months and has a minimum product availability until 2030. The SoM is pin-compatible

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NEURAL COMPUTING KIT COMBINES ATOMIC PI SBC WITH INTEL’S NCS2

NEURAL COMPUTING KIT COMBINES ATOMIC PI SBC WITH INTEL’S NCS2

Following the success of their last product; the Atomic Pi SBC which sold for only $34 and sold out multiple times, Team IoT, has returned with another successful Kickstarter project for a Neural Computing Development Kit that combines the Intel Cherry Trail-based Atomic Pi SBC with a 2GB RAM and 16GB eMMC, with Intel’s Neural Compute Stick

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MICROSOFT AI DEVELOPER KIT RUNS LINUX ON QUALCOMM SOC

MICROSOFT AI DEVELOPER KIT RUNS LINUX ON QUALCOMM SOC

Microsoft has announced a $249 “Vision AI Developer Kit, aimed at AI edge developers using Azure IoT Edge and Azure Machine Learning. The kit features an 8MP, 4K camera which runs Linux on Qualcomm’s 10nm, AI-enabled QCS603 SoC. The Vision AI Developer Kit incorporates Qualcomm’s Vision Intelligence Platform, which is infused into its QCS603 SoC, with Microsoft’s Azure IoT Edge service, built on

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E CON SYSTEMS LAUNCHES 5MP MONOCHROME USB 3.1 SUPERSPEED CAMERA

E-CON SYSTEMS LAUNCHES 5MP MONOCHROME USB 3.1 SUPERSPEED CAMERA

e-con Systems Inc., a leading camera solutions company, today announced the launch of See3CAM_CU55M, a 5 MP Monochrome USB 3.1 Gen 1 SuperSpeed Camera. With a 1/2.5” AR0521 CMOS image sensor from ON Semiconductor, backed by 2.2ÎŒm x 2.2ÎŒm pixel BSI technology, this camera produces monochrome images of exceptional quality. See3CAM_CU55M includes a high level of SNR, which

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