LATEST TYSOM KIT ACCELERATES THE DEVELOPMENT OF AI
Aldec’s TySOM-3A-ZU19EG embedded system development board, showcased at Embedded World 2019, supports the early co-development and co-verification of hardware and software.
Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has launched the TySOM-3A-ZU19EG, to assist in the development of AI, Deep-learning Neural Network (DNN) and other applications dependent on complex algorithm acceleration in firmware.
This much-anticipated addition to Aldec’s popular family of embedded development kits showcased at Embedded World on booth 4-560 in Hall 4, features a Xilinx Zynq® UltraScale+™ ZU19EG FFVB1517 MPSoC, which has more than 1 million logic cells, and a quad-core ARM® Cortex-A53 platform running at up to 1.5GHz. The kit provides 64-bit processor scalability while combining real-time control with soft and hard engines for SoC prototyping solution, IP verification, graphics, video, packet processing and early software development.
This latest addition to the Aldec TySOM range is our most powerful yet,” comments Zibi Zalewski, General Manager of Aldec’s Hardware Division, “and while it is suitable for the development of some of today’s most complex applications, such as AI and DNN, it is an extremely scalable solution, so remains a cost-effective proposition for small to mid-size SoC FPGA and ASIC prototyping. Few if any other platforms represent a similarly sound and long-term investment.
The TySOM-3A-ZU19EG is designed to provide flexibility when selecting peripherals, because of leveraging all the features of the Zynq UltraScale+.
The kit contains 8GB DDR4 SODIMM Memory for the Programmable Logic (PL) and 8GB DDR4 SODIMM Memory for the Processing System (PS). It also includes 2GB NAND memory, supports Micro-SD card storage, SATA storage and features a 512MB QSPI Flash Memory.