SECO “SBC-C43” MODULE FEATURES CORTEX-A72 ENABLED I.MX8.

Seco is developing a 3.5-inch “SBC-C43”, which runs Linux or Android on an up to hexa-core i.MX8, offering up to 8GB soldered DDR4 and 32GB eMMC plus WiFi/BT, 2x GbE, 3x USB, HDMI 2.0 in and out, 2x M.2, and -40 to 85°C support. Seco’s 3.5-inch SBC enables soldered memory and optional industrial temperature support. It’s built to support medical devices, digital signage, edge computing, industrial automatio ...

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SAMSUNG DEVELOPS INDUSTRY’S FIRST 3RD-GENERATION 10NM-CLASS DRAM

New 8Gb DDR4 Based On Most Advanced 1z-Nm Process Enables DRAM Solutions With Ultra-High Performance And Power Efficiency. Samsung Electronics, the world leader in advanced memory technology, today announced that it has developed a 3rd-generation 10-nanometer-class (1z-nm) eight-gigabit (Gb) Double Data Rate 4 (DDR4) DRAM for the first time in the industry. In just 16 months since it began mass producing th ...

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640 K ought to be enough for anyone…

Whether he really said that or not is still up for debate. The quote appeared at the beginning of an editorial written by James E. Fawcette published in the April 29, 1985 issue of InfoWorld and the was attributed to a certain William Gates, chairman of Microsoft in response to a question about why PC-DOS had an upper memory limit of 640 KB. Well, things move on and at the Mobile World Congress in Barcelona ...

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LATEST TYSOM KIT ACCELERATES THE DEVELOPMENT OF AI

Aldec’s TySOM-3A-ZU19EG embedded system development board, showcased at Embedded World 2019, supports the early co-development and co-verification of hardware and software. Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has launched the TySOM-3A-ZU19EG, to assist in the development of AI, Deep-learning Neural Network (DNN) and other appl ...

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CONGATEC ANNOUNCES A COM EXPRESS TYPE 7 MODULES FOR THE AIRCRAFT INDUSTRY

A new milestone is hit by Congatec, as they recently announced Type 7 modules. Congatec has struggled hard to take Linux friendliness to the very next level and to make server response to quickest possible till date. To do that, two Type 7 modules are introduced to the market which provide support of up to 96GB DDR4 and designed for converged edge servers in aircraft. The two modules introduced are: Conga-B ...

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CYPRESS SEMICONDUCTOR SERIAL FRAM NONVOLATILE MEMORY DEVICES

Cypress Semiconductor Serial F-RAM (ferroelectric RAM) memories combine the nonvolatile data storage capability of ROM with the fast speeds of RAM. Serial F-RAM features a variety of interface and density options, including SPI and I2C interfaces, industry-standard packages, and densities ranging from 4KB to 4MB. Cypress Serial F-RAMs have three distinct advantages over other nonvolatile memory technologies ...

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Avnet Releases UltraZed-EV Starter Kit

Avnet  a leading global technology solutions provider, today released the UltraZed-EV™ Starter Kit, providing designers with the core tools necessary to shape the future of advanced embedded vision design and turn their ideas into reality. By bundling the new UltraZed-EV System on Module (SOM) and Carrier Card, Avnet has created a complete platform for prototyping and evaluating embedded video processing sy ...

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Kontron’s Latest COM Express Features Intel’s 8th Gen Coffee Lake Processors

Kontron, a Germany based company has published its first product based on Intel’s 8th Gen “Coffee Lake” processors. The COMe-bCL6 joins other “Coffee Lake” based COM Express Basic Type 6 modules including the Congatec Conga-TS370 and Seco COMe-C08-BT6, which were announced early this month. The COMe-bCL6 feature set is very related to all these products, with Coffee Lake enabled features like additional PCI ...

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New Small Form Factor PCs from Asus- CES 2018

CES is one the largest gathering places for people in the technology industry for introducing their new products and understanding the new technology trends. Asus is one of the biggest hardware, and robotics companies to be attending. This company will be displaying their small form factor solutions: PB40, PN40 mini PCs, Chromebox 3, and thinker board S. The main goal of this products is to offer a small an ...

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96-LAYER MEMORY CHIPS BY TOSHIBA

The need for larger memory storage for smartphones will never stop, especially with the continuous development of larger and stronger applications. This need is always pushing semiconductor manufacturers to keep trying to fit as much bits as possible in  smaller volumes and with lower costs. To achieve this, memory chips are now growing in three dimensions instead of two. Recently, Toshiba has developed a n ...

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