Electronics News and Updates

MAXIM INTEGRATED MAXM17625 MAXM17626 USLIC™ STEP-DOWN POWER MODULES

MAXIM INTEGRATED MAXM17625/MAXM17626 USLIC™ STEP-DOWN POWER MODULES

Maxim Integrated MAXM17625/MAXM17626 uSLIC™ Step-Down Power Modules are high-frequency Himalaya synchronous step-down DC-DC modules with integrated MOSFETs, compensation components, and inductors. The MAXM17625 and MAXM17626 support up to 600mA load current and allow the use of small, low-cost input and output capacitors. The Modules operate over a wide 2.7V to 5.5V input voltage range. The output voltage is adjustable …

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A31315 3D MAGNETIC POSITION SENSORS

A31315 3D MAGNETIC POSITION SENSORS

Allegro’s A31315 robust, fully integrated 3DMAG™ Hall effect magnetic position sensors are designed to support a wide range of non-contact rotary and linear position measurements in automotive, industrial, and consumer applications. This family of sensors integrates vertical and planar Hall effect elements to detect two out of three magnetic field components (X, Y, and Z). Using configurable …

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ANALOG DEVICES ANNOUNCES PRIMARY BATTERY SOH MONITOR WITH PRECISION COULOMB COUNTER

ANALOG DEVICES ANNOUNCES PRIMARY BATTERY SOH MONITOR WITH PRECISION COULOMB COUNTER

Analog Devices announced a new IC. The LTC3337 is a primary battery state of health (SOH) monitor with a built-in precision coulomb counter. It is designed to be placed in series with a primary battery with minimal associated series voltage drop. The patented infinite dynamic range coulomb counter tallies ALL accumulated battery discharge and stores it in …

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FTDI CHIP HIGH-SPEED USB BRIDGE ICS WITH TYPE-C CONTROLLERS

FTDI CHIP HIGH-SPEED USB BRIDGE ICS WITH TYPE-C CONTROLLERS

FTDI Chip High-Speed USB Bridge ICs with Type-C/PD 3.0 Controllers fully support the latest USB Type-C and Power Delivery (PD) standards. This enables the support for power negotiation with the ability to sink or source current to USB host devices. These high-speed USB bridge devices feature up to two PD ports viz, PD1 port and PD2 port. The PD1 port shares the same …

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FLEXIBLE ELECTRONICS LET FORM FOLLOW FUNCTION

FLEXIBLE ELECTRONICS LET FORM FOLLOW FUNCTION

Supercapacitors, ultracapacitors, and electric double layer capacitors. No matter to which they are referred, this passive electronics component has some very desirable properties for the Internet of Things (IoT), smart wearables, and energy harvesting markets. Supercapacitors are ideal for providing efficient power pulses for transmitting data and rapidly collecting energy from intermittent sources, and to …

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TPS25750 – HIGHLY INTEGRATED USB TYPE-C® AND USB PD CONTROLLER WITH PRE-CONFIGURED GUI

TPS25750 – HIGHLY INTEGRATED USB TYPE-C® AND USB PD CONTROLLER WITH PRE-CONFIGURED GUI

Texas Instruments TPS25750 USB Type-C & Power Delivery (PD) Controller is optimized for applications supporting USB-C PD Power. The TPS25750 integrates fully managed power paths with robust protection for a complete USB-C PD solution. The Texas Instruments TPS25750 also integrates control for external battery charger ICs for added ease of use and reduced time to market. The intuitive web-based graphical user …

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WIDE ASPECT RATIO DISPLAY DELIVERS EXCELLENT COLOUR PERFORMANCE

WIDE ASPECT RATIO DISPLAY DELIVERS EXCELLENT COLOUR PERFORMANCE

Industrial LCD manufacturer KOE (Kaohsiung Opto-Electronics) has announced the introduction of a new high-performance 6.2-inch TFT display module. The TX16D206VM0BAA TFT display features HVGA resolution (640 x 240 pixels), a wide 8:3 aspect ratio, and IPS (in-plane switching) technology which delivers exceptional optical performance. The KOE TX16D206VM0BAA display module provides the ideal solution for use in process …

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CERERBRAS’ ALL NEW WAFER SCALE ENGINE PACKS 2.6 TRILLION TRANSISTORS FOR DEEP LEARNING WORKLOADS

CERERBRAS’ ALL NEW WAFER SCALE ENGINE PACKS 2.6 TRILLION TRANSISTORS FOR DEEP LEARNING WORKLOADS

In 2019, we saw one of the largest single computer chips manufactured by a California-based AI startup, Cerebras, that unveiled the Wafer-Scale Engine for deep learning applications. The 1.2 trillion transistors-packed Wafer-Scale Engine came with 18GB of on-chip SRAM and an interconnect speed of 100 Pb/s (Petabytes per Second). After two years of development, the manufacturer has launched …

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AXIOMTEK’S SERVER-GRADE ATX MOTHERBOARD POWERED BY THE LATEST 3RD GEN INTEL® XEON SCALABLE FOR AI AND HPC APPLICATIONS – IMB700

AXIOMTEK’S SERVER-GRADE ATX MOTHERBOARD POWERED BY THE LATEST 3RD GEN INTEL® XEON SCALABLE FOR AI AND HPC APPLICATIONS – IMB700

Axiomtek – a world-renowned leader relentlessly devoted in the research, development, and manufacture of series of innovative and reliable industrial computer products of high efficiency – is proud to introduce the IMB700, its new server-grade ATX motherboard powered by the latest dual LGA4189 socket 3rd Gen Intel® Xeon® scalable processors (code name: Ice Lake-SP) with the Intel® …

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