As strong demands of Edge AI storm across industries, ASRock Industrial delivers the most reliable, flexible, and powerful iEPF-9000S Series/ iEP-9000E Series Ruggedized Edge AIoT Platform with wide connectivity options (5G/4G, WiFi-6, BLE-5.1). It is capable and compact, a heterogeneous computing architecture that best suits your needs in various Industrial mission-critical applications.
ASRock Industrial Computer, the world leader in industrial motherboard and system is proud to release the new iEPF-9000S Series/ iEP-9000E Series Ruggedized Edge AIoT Platform powered by Intel® 10th Generation Xeon® W and Core™ i7/i5/i3 Processors (Comet Lake) with W480E, Q470E, and H420E chipsets for supreme performance, flexible integration, and reliable durability at the Edge. Featuring workload consolidation, the new Series provides super computing power, rich I/Os, expansions under the compact size, and ruggedness to ultimately replace traditional machines for PLC, HMI, Motion Control, Machine Vision, and more. This makes it well suited for Edge AI applications, such as smart factories, machine automation, AI vision in automated optical inspection, autonomous vehicles, and much more.
Super Computing Power for Edge AI Applications
There are two types of Ruggedized Edge AIoT Platform for next-level workload consolidation capability in different vertical markets. The iEPF-9000S Series Expendable Edge AIoT Platform is designed with flexible configurations and expansion slots for a variety of expansion cards; the iEP-9000E Series Compact Edge AIoT Platform is space-saving and fan-less in design with passive thermal solution. Both systems are powered by Intel® 10th Generation Xeon® W and Core™ i7/i5/i3 Processors (Comet Lake) with W480E, Q470E, and H420E chipsets for super computing power and support a total of four DDR4 SO-DIMM sockets up to 128GB, a phenomenal upgrade of memory size that is perfect for Edge AI applications.