High Bandwidth Low Latency Communication with SPI Devices Controlled by PIC32

Summary of High Bandwidth Low Latency Communication with SPI Devices Controlled by PIC32


This project implements a high bandwidth, low latency SPI communication system between a PIC32 microcontroller and an OV7670 camera module using eight 23LC1024 SRAM chips as buffers. The camera outputs parallel image data at high frequencies that the PIC32 alone cannot process in real time. By writing the data directly into SRAM arrays during image capture and reading it later serially through SPI, the system overcomes hardware speed mismatches. The project includes custom hardware logic for controlling chip select, clock, and data lines across two phases: writing to SRAM and reading out to a PC. The camera outputs YUV formatted images, which are processed into RGB for visualization. Despite challenges in camera quality and configuration, the system successfully acquires and transmits images.

Parts used in the High Bandwidth Low Latency Communication with SPI Devices Controlled by PIC32:

  • PIC32 Microcontroller
  • OV7670 Camera Module
  • Eight 23LC1024 SRAM chips
  • Logic ICs for chip select and clock line multiplexing
  • Oscilloscope (for debugging)
  • Function Generator (for clock generation)
  • Various resistors and diodes (for signal protection and line conditioning)
  • UART interface (for PC communication)

About The Author

Muhammad Bilal

I am a highly skilled and motivated individual with a Master's degree in Computer Science. I have extensive experience in technical writing and a deep understanding of SEO practices.

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