chip

ULTRA SMALL CHIP LEVEL DC CONVERTER TO MEET ISOLATION PROTECTION REQUIREMENTS

ULTRA-SMALL CHIP LEVEL DC/DC CONVERTER TO MEET ISOLATION PROTECTION REQUIREMENTS

The new chip-level DC/DC converter,Β B0505ST16-W5Β from Mornsun is designed to meet automotive and medical application requirements. ThisΒ fixed input 0.5W DC/DC converterΒ is the SMD deviceΒ with reinforced 5KVAC high isolation and trimable output voltagesΒ of 3.3V, 3.7V, 5V, 5.4V available in a miniature SOIC16 package, with control ON/OFF pin that has a wide operating temperature of -55c to +125c. […]

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What is the purpose of a PCBA Design for Assembly DFA Review

Design for manufacturing and assembly: DFA&DFM

Product developers understand the challenges involved in creating a market-ready product. Even experienced designers often go through multiple prototype iterations before reaching a mass-production version. Design for X The Design for X (DFX) methodology divides product design into various disciplines, such as Design for Sustainability, Design for Cost, Design for Testing, Design for Manufacture and

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MAJOR BREAKTHROUGH IN CHIP ARCHITECTURE TECHNOLOGY

MAJOR BREAKTHROUGH IN CHIP ARCHITECTURE TECHNOLOGY

Keeping in mind the betterment ofΒ artificial intelligenceΒ and various other CPU intensive workload,Β EPFLΒ (Γ‰cole Polytechnique FΓ©dΓ©rale de Lausanne) engineers have developed a new single architecture that combining logic operations and data storage. It may hold the potential to lay the fundamental work for the upcoming generation of smaller, faster, and more energy-efficient devices. Engineers at EPFL’s Laboratory

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TINY MEMS RESONATORS INTEGRATE LOAD CAPACITORS

TINY MEMS RESONATORS INTEGRATE LOAD CAPACITORS

SiTime CorporationΒ announced that it has entered the $2 billion precision resonator market with theΒ ApexMEMSΒ family of MHz resonators. These new devices are the third-generation of SiTime silicon ctechnology and are available in a variety of MHz frequencies for high-volume electronics. Mobile and IoT applications such as Bluetooth wearables and wearables, high-speed connectivity interfaces, asset-tracking, as well

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COMPACT NON INVASIVE SENSOR CHIP DEVELOPED TO RECORD MULTIPLE HEART AND LUNG SIGNALS

COMPACT NON-INVASIVE SENSOR CHIP DEVELOPED TO RECORD MULTIPLE HEART AND LUNG SIGNALS

A team of researchers at the β€˜Georgia Institute of Technology’ has come up with aΒ non-invasive sensor-in-a-chipΒ that records details of the heartbeat, respiration rates, and lung sounds. It even tracks the wearer’s physical activities, such as walking. The signals are recorded in sync, potentially giving healthcare workers a detailed overview of a patient’s heart and lungs.

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A data acquisition system on a chip

A data-acquisition system on a chip

Multifunction data-acquisition systems have been around for a long time as stand-alone instruments, plug-in cards, cabled computer peripherals, and embedded in systems. Such systems are often designed with separate ADCs, DACs, and digital I/O devices. Many microcontrollers include ADCs and DACs, but that locks you into using that device. The AD5592R from Analog Devices combines

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PAC1934 – MICROCHIP’S NEW POWER MONITORING IC MEASURES POWER WITH 99 ACCURACY

PAC1934 – MICROCHIP’S NEW POWER-MONITORING IC MEASURES POWER WITH 99% ACCURACY

Microchip recently developed a precision power-and-energy-monitoring chip – PAC1934.Β The PAC1934 is a four channel power/energy monitor with current sensor amplifier and bus voltage monitors that feed high-resolution ADC. ItΒ works in conjunction with a Microchip software driver that is fully compatible with theΒ Energy Estimation EngineΒ (E3) built into the Windows 10 operating system. The whole setupΒ provides 99 percent

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