3d | Battery Guide

STMICROELECTRONICS LSM6DSOX INERTIAL MEASUREMENT UNIT (IMU), WITH MACHINE LEARNING CORE

LSM6DSOX – iNEMO 6DoF inertial measurement unit (IMU), with Machine Learning Core, Finite State Machine and advanced Digital Function. For battery operated IoT, Gaming, Wearable and Consumer Electronics. Ultra-low power and high accuracy The LSM6DSOX is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope boosting performance at 0.55 mA in high-performance […]

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RECORD-SMASHING SNAPMAKER 2.0 3D PRINTERS NOW AVAILABLE FOR WEBSITE PRE-ORDERS

The modular 3D printer line, available in 3 models, is now available for pre-order from Snapmaker.com after becoming the most-funded technology project on Kickstarter After breaking multiple records with the Snapmaker 2.0 Kickstarter campaign, Snapmaker is today announcing that the 3D printer line is now available for pre-orders on Snapmaker.com. The Snapmaker 2.0 raised $7,850,866

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SODIMM MODULE FEATURES I.MX8M MINI/NANO WITH UP TO 8GB RAM

iWave Systems, a leader in embedded systems and solutions, will be launching a new System on Module based on NXP® i.MX8M Mini/Nano application processor. SOM will feature a powerful combination of 4 x ARM Cortex®-A53 @ 1.8GHz*, 64-bit processor and 1 x ARM® Cortex®-M4 core @ 400 MHz. The powerful SoC coupled with other advanced features such as flexible LPDDR4 & eMMC memory

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SNAPMAKER 2.0 3D PRINTER: FASTEST EVER PROJECT TO REACH $1M ON KICKSTARTER!

Snapmaker, the 3D printer brand that had the second most funded and fulfilled 3D printing campaign on Kickstarter, has secured another crowdfunding success with the launch of the Snapmaker 2.0. Having raised over $2M in only an hour on Kickstarter, the Snapmaker 2.0 is the latest generation of 3-in-1 3D printers from Snapmaker. Available in 3 models

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WORLD’S FIRST CONSUMER 3D CHOCO PRINTER STARTING AT 198 €

It’s not just another 3D printer – it is all about Choco, edible and incredibly fancy, if you make your own Choco objects with mycusini – the first consumer 3D Choco printer coming up on Kickstarter. Create 3D Choco give-aways for your loved ones or the Choco highlight on your dessert. Easily filled with delicious

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EPIC-KBS9-PUC: PROVEN PERFORMANCE FOR YOUR EMBEDDED APPLICATION

AAEON, an industry leader in embedded computing systems, announces the EPIC-KBS9-PUC barebones embedded system. Built upon our success and knowledge, the EPIC-KBS9-PUC offers the power of 6th and 7th Generation Intel Core Processors, four Gigabit Ethernet ports, and a range of expandability and customization to support your application. The EPIC-KBS9-PUC is a barebones system based on our

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HOMEBREW DMX-CONTROLLED RGB LED LIGHT

This project is a small DMX-512 controlled, color-changing RGB LED light. The light can be controlled via the DMX512 protocol or it can run a number of built-in programs depending on how the software is configured. The light incorporates an advanced 16-bit PIC24 microcontroller with PWM capabilities, a 3D printed enclosure, a laser cut acrylic

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3D TLC NAND Flash technology enters the Industry

3D TLC NAND flash based products are already dominating in SSD for consumers. Sophisticated NAND FLASH manufacturing technology, new advanced FLASH controllers and firmware now allow using 3D TLC NAND in industrial grade SSDs. Apacer introduces a new ST170 series in 2.5″ SSD, M.2, mSATA, MO-297, CFast and uSSD form factors. To make products reliable and

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SLIMLINE NVME SSD OUTPERFORMS SATA MODELS

Western Digital Corp. , a global data infrastructure leader, is accelerating the NVMe transition of value-PC storage by adding an NVMe™ model to its award-winning WD Blue® solid state drive (SSD) portfolio, the WD Blue SN500 NVMe SSD. The new SSD delivers three-times the performance of its SATA counterpart1 while maintaining the reliability the WD Blue product line

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TDK CLAIMS SMALLEST POINT-OF-LOAD DC-DC CONVERTER

µPOL DC-DC converters bring highest power density to space-constrained apps TDK Corporation announces the new series of µPOL™ DC-DC converters, the industry’s most compact and highest power density point-of-load solutions for applications such as big data, machine learning, artificial intelligence (AI), 5G cells, IoT and computing enterprise. Rather than using side by side discrete integrated circuit

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