TDK CLAIMS SMALLEST POINT-OF-LOAD DC-DC CONVERTER




µPOL DC-DC converters bring highest power density to space-constrained apps

TDK Corporation announces the new series of µPOL™ DC-DC converters, the industry’s most compact and highest power density point-of-load solutions for applications such as big data, machine learning, artificial intelligence (AI), 5G cells, IoT and computing enterprise.

TDK CLAIMS SMALLEST POINT-OF-LOAD DC-DC CONVERTER

Rather than using side by side discrete integrated circuit (IC) and discrete inductor (L) the new FS series integrates the IC and inductor in a compact configuration which offers a high-density solution for space-constrained applications requiring a low-profile power source.

At 3.3 x 3.3 x 1.5 mm, they minimize the required external components, retaining the highest possible performance while offering a simplified design for ease of integration. This family can deliver a high density solution of 1 watt per mm3, while offering 50% less solution size than the other products available in its class. As a result, this minimizes system solution cost, reduces board size and assembly costs, as well as BOM and PCB costs. It operates at a broad junction temperature range, from -40 °C to 125 °C. Mass production of FS1406 is expected to begin in Q3 2019.

TDK has been developing patents related to these innovations (US 9,729,059 and US 10,193,442) over several years. µPOL™ were developed by TDK’s group company Faraday Semi. These new solutions incorporate high-performance semiconductors in advanced packaging technologies such as semiconductor embedded in substrate (SESUB) and advanced electronic components to achieve unique system integration in a smaller size and lower profile by 3D integration. This integration allows TDK to deliver higher efficiency and ease of use at a lower total system cost to what is currently available today.

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