Fibocom, a leading global provider of IoT (Internet of Things) wireless solution and wireless communication modules, announces the joint release of the FM350 5G wireless module on May 31st, before MWC 2021 (Mobile World Congress 2021). Partnered with Intel and MediaTek, Fibocom’s FM350 is designed to offer high-speed 5G wireless connectivity for better PC platform support and user experience.
Based on the MediaTek T700 chipset platform, Fibocom’s FM350 module supports the 5G NR Sub-6 band with up to 4.67 Gbps on the downlink and 1.25 Gbps on the uplink theoretically.
Supporting 5G standalone network (SA) and non-standalone (NSA) network architectures, the Fibocom FM350 5G module is backward compatible with LTE/WCDMA network standards, which helps to reduce complexity in end product configuration.
Fibocom’s FM350 module is ideally suitable for PCs (laptop, desktop, tablet, etc.), and it supports Windows, Linux and Chrome operating systems. Designed with standard M.2 form factor, the module has various interfaces, including PCIe 3.0, USIM, I2C, Body SAR, MIPI Tuner, tunable antenna, etc., unleashing the potential of cellular technology to meet high speed bandwidth application demand. In addition, FM350 has a built-in eSIM, providing end users the flexibility to select carrier profiles. It also supports GNSS, including GPS, GLONASS, BeiDou, and Galileo.
The Fibocom FM350 module is globally certified by regional regulatory bodies, mainstream carriers, industry institutions, and has obtained approval from several technical certification laboratories.
We are very excited to partner with Intel and MediaTek to deliver a new generation of 5G solution for PC. Based on the MediaTek T700 chipset, Fibocom’s FM350 5G module is an excellent step forward in the proliferation of 5G in PC, allowing users to seamlessly connect to the 5G networks worldwide. The module is an excellent addition to our 5G wireless module family, enabling the high-bandwidth and secure PC experience brought by 5G technology,