Designed for use in Advanced Robotics and Drones, Premium Camera Applications, Artificial Intelligence Platforms, and other Cutting-edge IoT Devices.
Intrinsyc Technologies Corporation, a leading provider of solutions for the development and production of embedded and Internet of Things (IoT) products, today announced the Open-Q™ 845 µSOM (micro System on Module) and Development Kit, to be available in the fourth quarter of 2019.
The Open-Q™ 845 µSOM is the latest product in the evolution of Intrinsyc’s µSOM computing module series. It is an ultra-compact (50mm x 25mm), production-ready embedded module, ideal for powering the most advanced robotics, drones, cameras, and embedded IoT devices requiring the latest on-device AI powers. Featuring the Qualcomm® SDA845 system on chip (SoC) from Qualcomm Technologies, Inc., the 845 µSOM integrates many new features and capabilities in the same small form-factor:
- Higher performing Octa-core CPU – up to 2.6GHz on Gold cores
- New hardware-based security layers for vault-like defense
- Third generation Qualcomm® AI platform for immersive, on-device intelligence
- Four camera ports with flexible configurations supports up to 7 cameras
- New camera architecture for cinema grade video capture
- DisplayPort 4K60 via USB Type-C with USB super-speed data concurrency
- Additional USB3.1 port for device connectivity while using DisplayPort
- Gen3 PCIe interface.
This powerful new hardware platform will be supported by your choice of full-featured Android 9 or Yocto Linux operating systems, with plans for offering Android 10 by Q2 next year. The Android 9 operating system will be shipped on the development kit and is an ideal starting point for evaluation of the SOM and to kick-start your product development. If you prefer a Linux OS, that will be available to download from Intrinsyc and program onto your development kit. Full software documentation will also be included with purchase of the development kit.
We are excited to introduce this premium performance IoT computing module featuring; ultra-fast computational power, support for variety of AI frameworks, advanced video and image processing capabilities, an integrated secure processing unit, and other trailblazing features,” said Cliff Morton, Vice President, Solutions Engineering, Intrinsyc. “We will launch our development kit and SOM in the fourth quarter, 2019 and already have clients developing products with plans for commercial product launch in the first quarter, 2020.”
“Intrinsyc is a leader in developing embedded solutions for IoT products, and we’re excited to see them offer a premium-tier system to provide cutting-edge embedded solutions for drones, robots, and other applications using our Qualcomm SDA845 chipsets,” said Dev Singh, director, business development and head of robotics, drones, and intelligent machines, Qualcomm Technologies, Inc.
Read more: INTRINSYC ANNOUNCES NEW PREMIUM-TIER SYSTEM ON MODULE BASED ON QUALCOMM TECHNOLOGIES’ SDA845 SYSTEM ON CHIP