camera

BOXER 8150AI AI AT THE SPEED OF SIGHT

BOXER-8150AI: AI AT THE SPEED OF SIGHT

AAEON, an industry leader in AI solutions, announces the BOXER-8150AI, the latest in the BOXER-8100AI family of compact embedded AI Edge solutions powered by NVIDIA Jetson TX2. Featuring eight USB 3.0 ports, the BOXER-8150AI is designed to maximize framerates by providing higher bandwidth for USB connected cameras. The BOXER-8150AI features the powerful NVIDIA Jetson TX2 CPU paired with 8GB […]

BOXER-8150AI: AI AT THE SPEED OF SIGHT Read More »

SAELIG’S SAE106S DIGITAL PCB MICROSCOPE HAS 1080P RESOLUTION

SAELIG’S SAE106S DIGITAL PCB MICROSCOPE HAS 1080P RESOLUTION

High resolution inspection tool with built-in LCD designed for standalone PCB inspection. Saelig Company, Inc. announces the introduction of the Saelig SAE106S Digital Microscope, a versatile tool designed specifically for PCB inspection, but it will also prove to be useful in many other fields such as coin or mechanical part examination.  The SAE106S may be used as

SAELIG’S SAE106S DIGITAL PCB MICROSCOPE HAS 1080P RESOLUTION Read More »

CONVERSA – USB 3.1 CAMERA WITH MICROPHONE SUPPORTS LOW LIGHT

CONVERSA – USB 3.1 CAMERA WITH MICROPHONE SUPPORTS LOW LIGHT

e-con Systems is a leading camera solutions provider making state of the art camera modules, and also have recently added a new camera module to their collection called Conversa. e-con system’s cameras include standalone MIPI camera modules, USB cameras, and stereo cameras. The Conversa also known with the code name See3CAM_CU38 is a USB 3.1 Gen 1 based Camera with an

CONVERSA – USB 3.1 CAMERA WITH MICROPHONE SUPPORTS LOW LIGHT Read More »

LG AND INFINEON TO INTRODUCE LG G8THINQ WITH FRONT FACING TIME OF FLIGHT CAMERA

LG AND INFINEON TO INTRODUCE LG G8THINQ WITH FRONT-FACING TIME-OF-FLIGHT CAMERA

With Infineon’s REAL3™ Image Sensor Chip, LG Offers Enhanced Security and Depth Measuring Selfie Camera LG Electronics and Infineon Technologies AG have teamed up to introduce leading edge Time-of-Flight (ToF) technology to smartphone selfie photo lovers world over. Infineon’s REAL3™ image sensor chip will play a key role in the front-facing camera of the upcoming LG G8 ThinQ, to be unveiled

LG AND INFINEON TO INTRODUCE LG G8THINQ WITH FRONT-FACING TIME-OF-FLIGHT CAMERA Read More »

QUALCOMM UNVEILS SNAPDRAGON 855 HARDWARE DEVELOPMENT KIT HDK

QUALCOMM UNVEILS SNAPDRAGON 855 HARDWARE DEVELOPMENT KIT (HDK)

Snapdragon 855 is a popular, high-end processor that is found in premium smartphones such as Samsung Galaxy S10 or Xiaomi Mi 9. Recently Snapdragon 855 Mobile Hardware Development Kit appeared on Qualcomm developer website. The Qualcomm® Snapdragon™ 855 mobile hardware development kit (HDK) is a highly integrated and optimized Android development platform designed for technology companies to integrate and innovate mobile device development

QUALCOMM UNVEILS SNAPDRAGON 855 HARDWARE DEVELOPMENT KIT (HDK) Read More »