SNAPDRAGON 888 MOBILE HDK RUNS ANDROID 11 ON QUALCOMM’S LATEST 5NM SOC

Summary of SNAPDRAGON 888 MOBILE HDK RUNS ANDROID 11 ON QUALCOMM’S LATEST 5NM SOC


Qualcomm and Lantronix launched the Snapdragon 888 Mobile Hardware Development Kit, an Android 11 development platform built around the Snapdragon 888 SoC to help developers, hardware vendors, and OEMs accelerate device development and testing. The board features an octa-core Kryo 680 CPU, Adreno 660 GPU, Hexagon 780 DSP, Snapdragon X60 5G modem, 12GB LPDDR4x, 256GB UFS storage, multiple display and camera interfaces, Wi‑Fi 6, Bluetooth 5.1, and a variety of I/O and expansion options for building high-end smartphones, tablets, mobile PCs, IP cameras, and AI gateways.

Parts used in the Snapdragon 888 Mobile Hardware Development Kit:

  • Qualcomm Snapdragon 888 (SM8350) Kryo 680 CPU (1x Cortex-X1, 3x Cortex-A78, 4x Cortex-A55)
  • Adreno 660 GPU
  • Hexagon 780 DSP
  • Snapdragon X60 5G modem
  • 12GB LPDDR-3200 RAM
  • 256GB UFS 3.0 flash storage
  • MicroSD port
  • Up to 4K DSI-driven HDMI 2.0 port
  • DisplayPort 1.4 via USB 3.1 Type-C
  • 3.5mm audio jack
  • 2x 4-lane MIPI DSI display ports
  • 6x 4-lane MIPI CSI camera ports with 3D camera support
  • Optional 6.65 inch AMOLED touch screen (2340 x 1080)
  • Optional rear camera daughter card (16MP + 48MP + 13MP) with VGA ToF sensor
  • Optional front-facing camera accessory board (20MP IMX476 and MTT016 ToF)
  • GbE port
  • 802.11a/b/g/n/ac/ax WiFi 6 (Wi‑Fi 6E-ready)
  • Bluetooth 5.1
  • 1x USB 3.1 Type-C port
  • 2x USB 3.0 host ports
  • 1x micro USB 2.0 debug port
  • 2x M.2 slots
  • Low-speed and high-speed I/O connectors
  • 2x sensor expansion connectors
  • Power button
  • Volume button
  • 12V/5V power supply via power barrel jack

Qualcomm and Lantronix have come together to launch Snapdragon 888 Mobile Hardware Development Kit – a feature-rich Android development platform designed to provide Android app developers, hardware vendors, and original equipment manufacturers with the right software and tools needed to accelerate the development and testing of devices.

The Snapdragon 888 development board is powered by Qualcomm’s Snapdragon 888 octa-core Kryo 680 CPU with 1x Cortex-X1 core, 3x Cortex-A78 cores, and 4x Cortex-A55 cores, an Adreno 660 GPU, an Hexagon 780 DSP and a Snapdragon X60 5G modem. The processor is the latest premium mobile SoC from Qualcomm and it claims to have 25% faster CPU performance, 35% faster graphics rendering, 3x performance-per-watt improvement and 16x larger shared AI memory compared to its previous generation.

The Snapdragon 888 Dev board can be used to create a variety of high-end devices like smart-phones and tablets, mobile PCs, IP cameras, and artificial Intelligence gateways.

Features and Specifications of the development board include:

  • CPU: Qualcomm Snapdragon 888 (SM8350) Qualcomm Kryo 680 with:
    • 1x Cortex-X1 core running at 2.84 GHz
    • 3x Cortex-A78 cores running at 2.42 GHz, and,
    • 4x Cortex-A55 cores running at 1.80 GHz
  • GPU: Adreno 660 with support for OpenCL 2.0 FP, OpenGL ES 3.2, Vulkan 1.1, DX12, and up to 8K 360 VR video playback
  • Hexagon 780 DSP capable of 26 trillion operations per second (TOPS).
  • 12GB LPDDR-3200
  • 256GB of UFS 3.0 flash
  • 1x MicroSD port
  • Up to 4K DSI-driven HDMI 2.0 port
  • DisplayPort 1.4 via USB 3.1 Type-C
  • 3.5mm audio jack
  • 2x 4-lane MIPI DSI display ports
  • 6x 4-lane MIPI CSI with 3D camera support
  • Optional 6.65″ AMOLED touch screen with 2340 x 1080 resolution
  • Optional rear camera daughter card with 16MP + 48MP + 13MP camera, VGA ToF sensor
  • Optional front-facing camera accessory board with 20MP IMX476 front camera, MTT016 ToF camera
  • 1x GbE port
  • 802.11a/b/g/n/ac/ax WiFi 6 @ 2.4/5GHz; Wi-Fi 6E-ready
  • Bluetooth 5.1
  • 1x USB 3.1 Type-C port
  • 2x USB 3.0 host ports
  • 1x micro USB 2.0 port for debugging
  • 2x M.2 slots
  • Low-speed and high-speed I/O connectors
  • 2x sensors expansion connectors
  • Power Button
  • Volume button
  • 12V/5V power supply via power barrel jack
  • DIMENSIONS: 100 mm x 85 mm
  • OPERATING SYSTEM: Android 11

Read more: SNAPDRAGON 888 MOBILE HDK RUNS ANDROID 11 ON QUALCOMM’S LATEST 5NM SOC

Quick Solutions to Questions related to Snapdragon 888 Mobile Hardware Development Kit:

  • What CPU does the Snapdragon 888 Mobile HDK use?
    It uses the Qualcomm Snapdragon 888 (SM8350) Kryo 680 octa-core CPU with 1x Cortex-X1, 3x Cortex-A78, and 4x Cortex-A55 cores.
  • Which GPU and DSP are included on the development board?
    The board includes an Adreno 660 GPU and a Hexagon 780 DSP.
  • What memory and storage are provided on the board?
    It provides 12GB LPDDR-3200 RAM and 256GB of UFS 3.0 flash, plus a MicroSD port.
  • Does the dev kit support 5G connectivity?
    Yes, it includes a Snapdragon X60 5G modem.
  • What display and camera interfaces are available?
    It offers up to 4K DSI-driven HDMI 2.0, DisplayPort 1.4 via USB-C, 2x 4-lane MIPI DSI, and 6x 4-lane MIPI CSI with 3D camera support; optional AMOLED and camera modules are available.
  • Which wireless standards does the board support?
    It supports 802.11a/b/g/n/ac/ax WiFi 6 (Wi‑Fi 6E-ready) and Bluetooth 5.1.
  • What USB and expansion ports are provided?
    It includes 1x USB 3.1 Type-C, 2x USB 3.0 host ports, 1x micro USB 2.0 debug port, and 2x M.2 slots, plus various I/O connectors and sensor expansion connectors.
  • What operating system does the Snapdragon 888 HDK run?
    The development kit runs Android 11.
  • What devices can be developed with this board?
    The board can be used to create high-end smartphones, tablets, mobile PCs, IP cameras, and AI gateways.
  • What are the board dimensions and power input?
    The dimensions are 100 mm x 85 mm and it uses a 12V/5V power supply via a power barrel jack.

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