Electronics News and Updates

ULTRA SMALL CHIP LEVEL DC CONVERTER TO MEET ISOLATION PROTECTION REQUIREMENTS

ULTRA-SMALL CHIP LEVEL DC/DC CONVERTER TO MEET ISOLATION PROTECTION REQUIREMENTS

The new chip-level DC/DC converter, B0505ST16-W5 from Mornsun is designed to meet automotive and medical application requirements. This fixed input 0.5W DC/DC converter is the SMD device with reinforced 5KVAC high isolation and trimable output voltages of 3.3V, 3.7V, 5V, 5.4V available in a miniature SOIC16 package, with control ON/OFF pin that has a wide operating temperature of -55c to +125c. […]

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LANTRONIX RELEASES OPEN-Q 5165RB SYSTEM-ON-MODULE FOR EDGE ROBOTICS APPLICATIONS

Lantronix has recently launched a system-on-module and its integrated development board based on Qualcomm QRB5165 System-on-Chip running Ubuntu Linux OS. The Open-Q 5165RB system-on-module has been designed with a compact form factor of just 29×50 mm for edge robotics applications. Along with the public launch comes another hardware on the same Qualcomm system-on-chip, but a development board with all the header to explore the

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WURTH ELEKTRONIK THETIS I WITH EVALUATION KIT

WÜRTH ELEKTRONIK THETIS-I WITH EVALUATION KIT

Würth Elektronik launches Thetis-I, a ready-to-use radio module for Wirepas mesh networks. Thetis-I is the perfect solution for IoT device manufacturers. Networks with technology from Wirepas, the Finnish software provider, are self-healing and freely scalable. Each device with a Thetis-I radio module can also act as a router which means no further infrastructure is required for mesh communication. Würth Elektronik

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FIBOCOM LTE-A PRO MODULE SERIES NL952 ACCELERATES THE DIGITAL JOURNEY WITH T-MOBILE CERTIFICATE

Fibocom, a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, announces that its LTE Advanced Pro module NL952-NA has been successfully certified by T-Mobile. The module is now qualified to provide wireless connection services under T-Mobile’s network, which further expands the product’s application coverage over the US market. Based on the Qualcomm Snapdragon

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EPISHINE SIGNS DISTRIBUTION AGREEMENT WITH FARNELL TO ENABLE LIGHT ENERGY HARVESTING WITHIN ELECTRONIC DESIGN

The innovative Swedish manufacturer of printed organic solar cells and development kits Epishine has signed a new franchise agreement with Farnell, an Avnet Company and global distributor of electronic components, products, and solutions. The new-to-market printed organic solar cells are optimized for harvesting energy from indoor, low energy lighting enabling organic solar power to be

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PRODIGY PGY-LA-EMBD LOGIC ANALYZER HANDS-ON REVIEW

Since its introduction in 1973 by Hewlett Packard, Logic Analyzers have been one of the most important tools in an engineer’s toolkit. Logic Analyzers enable us to easily debug digital logic signals by capturing the data and plotting it in a time-view format. They serve a similar purpose as an oscilloscope, which is a tool to view

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OPEN SOURCE UNSURV OFFLINE FEATURES ESP32, GNSS

A campaign has been launched on Crowd supply for Unsurv, which is an offline privacy-friendly, small, lightweight PCB (43 mm x 32 mm) loaded with an ESP32, GNSS reciever and NFC capabilities. It functions by using a combination of OpenStreetMap data on the SD card, and a custom Android app, enabling you to gather GNSS data throughout the day, and easily analyzing

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ADA4570 ANISOTROPIC MAGNETORESISTIVE (AMR) SENSORS

ADI’s ADA4570 is an AMR sensor with integrated signal conditioning amplifiers and ADC drivers. It produces four analog outputs that indicate the angular position of the surrounding magnetic field. The ADA4570 consists of two die within one package, an AMR sensor, and a fixed gain instrumentation amplifier. It delivers clean and amplified differential cosine and sine output

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RT1105 SERIES REVERSE THROUGH-HOLE TACT SWITCH

E-Switch’s RT1105 series reverse through-hole tact switch with multiple gram force options provides up to 100,000 cycle life expectancy in a 6.80 mm x 6.80 mm footprint. This switch series features a soft silicon actuator 4.40 mm high and provides multiple gram force options identified by different color actuators, 160 gf (red), 260 gf (dark

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MAXIM INTEGRATED MAX31827 LOW-POWER TEMPERATURE SWITCH

Maxim Integrated MAX31827 Low-Power Temperature Switch provides an ±1°C accuracy from -40°C to +125°C (12 bits) local temperature switch and sensor with I2C/SMBus interface. The MAX31827 switch offers high accuracy in a small 6-bump wafer-level package (WLP), making it ideal for a wide range of applications. The Maxim MAX31827 Low-Power Temperature Switch can be used as a temperature switch with preconfigured

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