Summary of NEW CERAMIC CAPACITOR WITH MAXIMUM THICKNESS OF 0.22 MM
Murata introduces the LLC152D70G105ME01, an ultra-thin 0.22 mm MLCC in a 0204 inch size designed for in-vehicle ADAS. This low ESL component features a reversed electrode construction that optimizes noise suppression and lowers power supply impedance when placed near processors. Its compact footprint allows implementation on the back of processor packages or close to main chips, supporting high-performance IC stabilization required for advanced self-driving technologies.
Parts used in the Murata Ultra-thin LW Reversed Low ESL Chip MLCC Project:
- LLC152D70G105ME01 decoupling capacitor
- 0204 inch size (0.5 x 1.0 mm) footprint chip
- Motherboard
- Main processor
- Processor package
- Power supply line
- Ceramic elements
Murata’s Ultra-thin LW Reversed, Low ESL Chip MLCCs in 0204 inch Size Design for In-vehicle ADAS Applications
Murata introduces the ultra-thin LW reversed, low equivalent series inductor (ESL) multilayer ceramic capacitor (MLCC) with a capacitance value of 1.0 µF ±20% for 4 Vdc-rated automotive applications. With a 0204 inch size (0.5 x 1.0 mm) footprint and maximum thickness of just 0.22 mm, the LLC152D70G105ME01 decoupling capacitor can be implemented on the back of a processor package, contributing to lower impedance of a power supply line. It can also sit close to the main processor on the motherboard.
Compared to standard MLCCs, the LW reverse construction flips the electrodes through 90° so they are positioned on the long side of the rectangular chip. This change in construction reverses the length-to-width ratio, providing effective noise suppression in high-frequency applications.
As advanced driver-assistance systems (ADAS) continue to evolve to increase safety and, ultimately, deliver self-driving vehicles, ICs for in-vehicle equipment have become increasingly high-performance. To stabilize these ICs, more focus is being put on lowering the power supply lines’ impedance. Thanks to Murata’s proprietary thin layer technology for ceramic elements and thin-sheet formation technology, the LLC152D70G105ME01 LW reversed, low ESL chip MLCCs are effective for achieving a low-impedance design.
Read more: NEW CERAMIC CAPACITOR WITH MAXIMUM THICKNESS OF 0.22 MM
- What is the capacitance value of the new Murata MLCC?
The device offers a capacitance value of 1.0 µF ±20%. - How does the LW reverse construction differ from standard MLCCs?
It flips the electrodes through 90° so they are positioned on the long side of the rectangular chip. - Can this capacitor be implemented on the back of a processor package?
Yes, it can be implemented on the back of a processor package to contribute to lower impedance. - Does this component help stabilize high-performance ICs in ADAS?
Yes, it helps stabilize ICs by lowering the power supply lines' impedance. - What is the maximum thickness of the LLC152D70G105ME01 capacitor?
The maximum thickness is just 0.22 mm. - What technology enables the low-impedance design of this MLCC?
It utilizes Murata's proprietary thin layer technology for ceramic elements and thin-sheet formation technology. - Is this component rated for automotive applications?
Yes, it is designed for 4 Vdc-rated automotive applications. - What benefit does reversing the length-to-width ratio provide?
This change provides effective noise suppression in high-frequency applications.
