The future of IC design
To celebrate 60 years of EDN, we’re looking into the future to predict what advancements will be made in IC Design in the next 60 years. By 2076 3-D room-temperature, superconducting, quantum, neuromorphic, and photonic mixed-signal devices will be the common denominator for all integrated circuit designs. Design tools will be so sophisticated that even novice designers will be able to mix and match these technologies into system-in-package designs that solve all application problems behind the scenes. Users will be so used to extensions to their innate brain capabilities that the technologies which perform the tasks will be taken for granted, leaving the engineering community—and its robotic assistants—on a unique echelon of society that actually understands how the world works.
3D stacked memories
BeSang’s 3D stacked memories integrate memory cells in the vertical direction atop standard complementary metal oxide semiconductor (CMOS) logic, therefore boosting memory density in the smallest possible footprint. Unlike 3D NAND, BeSang’s 3D stacked-memory designs can be applied to almost any type for memory including DRAM, NAND- and NOR-flash. BeSang believes its architecture will expand silicon memories’ lifespan for at least 20 years after the end of Moore’s Law and maybe even to 2076.
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