Axiomtek – a world-renowned leader relentlessly devoted in the research, development and manufacture of series of innovative and reliable industrial computer products of high efficiency – is pleased to introduce the MIRU130, a high-end embedded vision and AI motherboard optimized for machine vision and deep learning applications. It is powered by the onboard AMD RYZEN™ Embedded V1807B/V1605B processor with AMD Radeon™ RX Vega graphics. The embedded vision board has two PoE GbE LAN ports for camera interfaces and an integrated real-time vision I/O that includes 4-CH isolated DIO. The MIRU130 was designed to help developers to deploy vision-based AI applications faster and easier.
The size of MIRU130 is 244 x 170mm – the size between Micro-ATX and Mini-ITX form factor, which provides customers with the convenience of finding chassis on the market. Its vision-specific I/O integrates 2-CH trigger input, 2-CH LED lighting controller, 2-CH camera trigger output and an encoder input for conveyor tracking. Furthermore, the MIRU130 is integrated with AMD Radeon™ RX Vega graphics with support of DirectX 12 and offers dual display capability through one HDMI and one DisplayPort interfaces.
According to MarketsandMarkets Research, the global computer vision market size is expected to grow from USD 10.7 billion in 2020 to USD 14.7 billion by 2025, at a CAGR of 6.5% during the forecast period. The major driver for the growth of the computer vision market is the growing demand for automated vision inspection and increasing adoption of vision-guided robot systems,” said Michelle Mi, product manager at Axiomtek. “The MIRU130 comes with two IEEE 802.3at PoE ports and two GbE LANs for connecting industrial cameras. Its vision I/O integrates a full range of isolated I/O interfaces and real-time controls essential which bring accurate interaction between lighting, camera, actuator and sensor devices. The motherboard is a multi-function embedded solution that addresses the needs and requirements of the computer vision market.
The MIRU130 offers multiple expansion interfaces with one M.2 Key E slot for wireless modules, one M.2 key B slot for 22×42 storage module or 30×42 cellular module and one PCIe x16 golden finger with PCIe x8 signal for graphics cards. Two 260-pin SO-DIMM sockets support up to 16GB of DDR4-2400 (V1605B) and DDR4-3200 (V1807B) memory. In addition, it has four USB 3.1 Gen2, three RS-232, one RS-232/422/485 and one SATA-600 allow users to connect multiple devices. The embedded board has a +12V DC power input with an optional +24V DC-in power board. The embedded platform was designed for reliable operation in harsh environments with a wide operating temperature range of -20°C to +60°C.