semiconductor

SKYLO PARTNERS WITH SONY SEMICONDUCTOR ISRAEL TO DEPLOY 5G READY NARROWBAND IOT CONNECTIVITY OVER SATELLITE

SKYLO PARTNERS WITH SONY SEMICONDUCTOR ISRAEL TO DEPLOY 5G-READY NARROWBAND-IOT CONNECTIVITY OVER SATELLITE

Narrowband-IoT Connectivity over Satellite The partnership brings 5G-ready NB-IoT over satellite for the first time and delivers massive cost and interoperability advantages for the IoT industry Skylo, maker of the world’s most affordable and ubiquitous network that connects any machine or sensor, today announced a partnership with Sony Semiconductor Israel (Sony, formerly known as Altair Semiconductor).

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X FAB SILICON FOUNDRIES TAPES OUT OPEN SOURCE RISC V MCU

X-FAB SILICON FOUNDRIES TAPES-OUT OPEN-SOURCE RISC-V MCU

X-FAB Silicon Foundries, the leading analog/mixed-signal and specialty foundry, together with crowd-sourcing IC platform partner Efabless Corporation, today announced the successful first-silicon availability of the Efabless RISC-V System on Chip (SoC) reference design. This open-source semiconductor project went from design start to tape-out in less than three months using the Efabless design flow based on

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X FAB OFFERS UNIQUE SUBSTRATE COUPLING ANALYSIS SOLUTION TO ADDRESS UNWANTED PARASITIC EFFECTS

X-FAB OFFERS UNIQUE SUBSTRATE COUPLING ANALYSIS SOLUTION TO ADDRESS UNWANTED PARASITIC EFFECTS

Powerful new tool facilitates first-time-right analog & high voltage design implementation in even the most challenging of scenarios. Continuing to drive innovation in analog/mixed-signal IC fabrication, X-FAB Silicon Foundries SE (http://www.xfab.com/) has announced the introduction of SubstrateXtractor. Unwanted substrate couplings can impact modern IC developments, causing parasitic effects that are damaging to overall performance. Engineers

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Low Power Barometric Pressure Sensor from Infineon Delivers New Levels of Accuracy for Mobile and Wearable Gadgets and IoT Devices 1

Low-Power Barometric Pressure Sensor from Infineon Delivers New Levels of Accuracy for Mobile and Wearable Gadgets and IoT Devices

Munich, Germany – February 26, 2015 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched an ultra-high ±5cm resolution, miniature MEMS (Micro Electro Mechanical Systems) pressure sensor for use in mobile and wearable gadgets and IoT (Internet of Things) devices. The DPS310 is a low-power digital barometric pressure sensor that enables the development

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RENESAS ELECTRONICS ACHIEVES

RENESAS ELECTRONICS ACHIEVES LOWEST EMBEDDED SRAM POWER OF 13.7 NW/MBIT

Renesas Electronics Corporation announced the successful development of a new low-power SRAM circuit technology that achieves a record ultra-low power consumption of 13.7 nW/Mbitin standby mode. The prototype SRAM also achieves a high-speed readout time of 1.8 ns during active operation. Renesas Electronics applied its 65nm node silicon on thin buried oxide(SOTB) process to develop this record-creating SRAM prototype. This new low-power SRAM

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Graphene Electronic Circuits with Atomic Precision

Graphene Electronic Circuits with Atomic Precision

Abstract The use of graphene in electronic devices requires a band gap, which can be achieved by creating nanostructures such as graphene nanoribbons. A wide variety of atomically precise graphene nanoribbons can be prepared through on-surface synthesis, bringing the concept of graphene nanoribbon electronics closer to reality. For future applications it is beneficial to integrate

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