Fujitsu sampling 1Mbit FRAM in WL-CSP package
Fujitsu is sampling a 1Mbit SPI FRAM in an 8-pin WL-CSP device measuring 3.09Γ2.28Γ0.33mm which reduces the surface mounting area by 77%, and the device height by 80% compared to an S0P-8 package. The WL-CSP package makes FRAM suitable for wearable and sensor applications which need small device dimensions, extremely low power consumption for maximum […]
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