3d

NITROGEN8M MINI IS THE FIRST SBC WITH I.MX8M MINI SOC

NITROGEN8M MINI IS THE FIRST SBC WITH I.MX8M MINI SOC

Boundary DevicesΒ has unveiled its β€œNitrogen8M-Mini” SBC, the first SBC that is based on NXP’s newΒ i.MX8M Mini SoC, and also the second embedded board with the first being Variscite’sΒ DART-MX8M-MiniΒ module. The SBC runs Linux on an up to 2GHz, quad -A53 i.MX8M Mini, and offers 2GB RAM, up to 128GB eMMC, PCIe, MIPI CSI/DSI, GbE, and optional […]

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REAL3β„’ TIME OF FLIGHT IMAGE SENSOR FOURTH GENERATION WITH HVGA RESOLUTION

REAL3β„’ TIME-OF-FLIGHT IMAGE SENSOR: FOURTH GENERATION WITH HVGA RESOLUTION

Infineon Technologies AGΒ is presenting the fourth generation of itsΒ REAL3β„’ image sensorΒ IRS2771CΒ at Mobile World Congress 2019 in Barcelona, Spain. The 3D Time-of-Flight (ToF) single chip is especially designed to meet the requirements of the mobile consumer device market and, in particular, demand for higher resolutions with small lenses. The wide range of use cases includes secure

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Mouser SamacSys Offer Engineers Free PCB Footprints Schematic Symbols and 3D Models

Mouser & SamacSys Offer Engineers Free PCB Footprints, Schematic Symbols and 3D Models

Mouser Electronics, Inc. the New Product Introduction (NPI) leader empowering innovation, is pleased to announce a new partnership with SamacSys, a global leader in electronic component library solutions. Under the new partnership, announced at electronica 2018 in Munich, Mouser will provide its customers with a range of free design resources including PCB footprints, schematic symbols,

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Imec Invented Unique Cost effective Cooling For High Performance Chips

Imec Invented Unique Cost-effective Cooling For High-Performance Chips

Imec, the distinguished Belgian research center has invented a new and cost-effective method ofΒ cooling chips. This achievement can be an important innovation to tackle the ever-increasing cooling demands of high-performance 3D chips and systems. Present powerful electronic systems have high cooling demands for integrated semiconductor chips. Conventional solutions operate with various passive (or occasionally active)

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3D magnetic sensor from Infineon

3D magnetic sensor from Infineon

Infineon will have engineering samples of a 3D magnetic sensor in July. Called TLV493D-A1B6 performs magnetic field detection in x, y, and z direction allowing the sensor to measure 3D linear and rotation movements. The digital IΒ²C interface enables bidirectional communication between sensor and microcontroller.The sensor is for consumer and industrial applications that require 3D

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