News & Updates

Newly Developed Internal Temperature Sensor For Li ion Battery Enables 5x Faster Charging

Newly Developed Internal Temperature Sensor For Li-ion Battery Enables 5x Faster Charging

Researchers at the University of Warwick in the UK have developed sensors which measure the internal temperature and electrode potential of Lithium batteries. The technology is being developed by the Warwick Manufacturing Group (WMG) as a part of a battery’s normal operation. More intense testings have been done on standard commercially available automotive battery cells. […]

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ULTRA LOW QUIESCENT LDO EXTENDS BATTERY LIFE FOR SENSORS AND PORTABLE DESIGNS

ULTRA-LOW QUIESCENT LDO EXTENDS BATTERY LIFE FOR SENSORS AND PORTABLE DESIGNS

With ultra-low quiescent current of 250 nA, the MCP1811 enables battery life which is four-times longer than conventional ultra-low Iq LDO regulators. Compact packages down to 1 x 1 mm also help the MCP1811 to minimise board space. The MCP1811/12 devices are 150 mA (MCP1811) and 300 mA (MCP1812) low dropout (LDO) linear regulators that provide high-current and low-output

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TS 4100 – A i.MX6 UL UltraLite Bases Hybrid SBC With FPGA And Programmable ZPU Core

TS-4100 – A i.MX6 UL (UltraLite) Bases Hybrid SBC With FPGA And Programmable ZPU Core

Technologic Systems has begun testing its first i.MX6 UL (UltraLite) based board, which is also its first computer-on-module that can work as a single board computer. The footprint of 75 x 55mm TS-4100 module features a microSD slot, onboard eMMC, a micro-USB OTG port with power support, and optional WiFi and Bluetooth. This board offers

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VISHAY VCNL4030X01 AECQ PROXIMITY SENSOR WITH FOUR I2C ADDRESS OPTIONS

VISHAY VCNL4030X01 AECQ PROXIMITY SENSOR WITH FOUR I2C ADDRESS OPTIONS

VCNL4030X01 integrates a PS, ALS and a high power IRED into one small package. It incorporates photodiodes, amplifiers, and analog to digital converting circuits into a single chip by CMOS process. The 16-bit high resolution ALS for excellent sensing capabilities with sufficient selections to fulfill applications whether dark or high transparency lens design. ALS and PS

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OPEN Q 845 HDK DEVELOPMENT BOARD INTEGRATES SNAPDRAGON 845 SOC AND RUNS ANDROID 8.0

OPEN-Q 845 HDK DEVELOPMENT BOARD INTEGRATES SNAPDRAGON 845 SOC AND RUNS ANDROID 8.0

Intrinsyc’s new Open-Q 845 HDK Development Kit has the same Mini-ITX (170 x 170mm) dimensions and sandwich-style design as the Open-Q 835 from the previous year. The main SoC, Snapdragon 845 is integrated into the board topped by a heatsink. This dev board includes a smartphone like 5.7-inch QHD (1440 x 2560) touchscreen controlled via MIPI-DSI, as well as a camera board

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ALVIUM VISION EMBEDDED CAMERAS SUPPORTS MIPI CSI USB 3

ALVIUM VISION EMBEDDED CAMERAS SUPPORTS MIPI-CSI & USB 3

Allied Vision Technologies GmbH in November announced its Alvium 1500 and Alvium 1800 embedded and machine vision camera series. The Alvium 1500 supports MIPI-CSI-2 interfaces and the Alvium 1800 supports MIPI-CSI-2 and USB3 Vision. They both have On Semi sensors featuring up to 2592 × 1944 px resolution and V4L2 drivers that support Jetson and i.MX6/8 dev boards. The Alvium SoC

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150VIN VOUT SYNCHRONOUS 4 SWITCH BUCK BOOST CONTROLLER WITH INTEGRATED SWITCHING BIAS SUPPLY

150VIN & VOUT SYNCHRONOUS 4-SWITCH BUCK-BOOST CONTROLLER WITH INTEGRATED SWITCHING BIAS SUPPLY

Analog Devices announces the Power by Linear™ LTC3777, a 150V high efficiency (up to 99%) 4-switch synchronous buck-boost DC/DC controller, which operates from input voltages above, below or equal to the regulated output voltage. Its 4.5V to 150V input voltage range operates from a high input voltage source or from an input that has high

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IMOTION™ IMM100 SERIES FROM INFINEON REDUCES PCB SIZE AND RD EFFORTS SIGNIFICANTLY

IMOTION™ IMM100 SERIES FROM INFINEON REDUCES PCB SIZE AND R&D EFFORTS SIGNIFICANTLY

Infineon Technologies AG introduces smart IPM motor controllers featuring full hardware and software integration needed for BLDC motor drives of up to 80W without heatsink. The new iMOTION™ IMM100 series combines the motor controller IC and a 3-phase inverter stage in a single, highly compact 12 x 12 mm 2 PQFN package. This combination enables BOM count and PCB size reduction, thus lowering system

IMOTION™ IMM100 SERIES FROM INFINEON REDUCES PCB SIZE AND R&D EFFORTS SIGNIFICANTLY Read More »

SOLID STATE SUPPLIES OFFERS WORLD’S SMALLEST BLUETOOTH® LOW ENERGY BLE MODULE

SOLID STATE SUPPLIES OFFERS WORLD’S SMALLEST BLUETOOTH® LOW ENERGY (BLE) MODULE

Acknowledged as the UK’s leading source of advanced embedded technology, Solid State Supplies Ltd. now offers the world’s smallest Bluetooth® Low Energy (BLE) SiP module from Silicon Labs. With a package size of 6.5mm x 6.5mm x 1.4mm the BGM11S Blue Gecko SiP (System in Package) module targets applications where ultra-small size, reliable high performance RF,

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RENESAS ELECTRONICS RAA210925 DC DC POWER MODULES

RENESAS ELECTRONICS RAA210925 DC/DC POWER MODULES

Renesas Electronics RAA210925 DC/DC Power Modules with PMBus Interface are pin-strap configurable dual 25A step-down PMBus-compliant DC/DC power supply modules. These power modules integrate a digital PWM controller, power inductor, synchronous MOSFETs, and passive components. The RAA210925 power modules deliver up to 25A of continuous output current without the need for additional heat sinking or airflow. These power modules offer

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