HiSilicon and Nowi’s continued collaboration has led to a 2nd generation Energy Autonomous NB-IoT platform optimised for ease-of-use and form factor. New Internet of Things applications are now possible, where physical size is limited and ‘Plug & Forget’ indefinite operation is required. HiSilicon (Shanghai) Ltd and Nowi Energy B.V. today showcased the 2nd generation of […]
TDK Corporation presents a new packing unit for CeraCharge, the world’s first SMD technology solid-state rechargeable battery, in the compact size EIA 1812 (4.4 x 3.0 x 1.1 mm3). The packing unit (B73180A0101M199) includes 10 blister-packed CeraCharge batteries that come in a vacuum-sealed plastic bag. The components are manufactured in regular series production and are suitable for
RECHARGEABLE 100-ΜAH BATTERIES COME IN PINT-SIZED SMD FORMAT Read More »
IBASE Technology Inc., a world leader in the manufacture of a wide range of digital solutions, has rolled out the SI-642-N 4K digital signage player that leverages the 8th Gen Intel® Core™ U-series processors. The platform can be used in commercial establishments to increase brand awareness and customer engagement or deployed in transportation networks to
FANLESS 4K DIGITAL SIGNAGE PLAYER WITH 8TH GEN INTEL® CORE™ U-SERIES PROCESSORS Read More »
Axiomtek – a world-renowned leader relentlessly devoted in the research, development, and manufacture of series of innovative and reliable industrial computer products of high efficiency – is pleased to release the DSP501-527, an ultra-slim 4K digital signage player powered by the 8th generation Intel® Core™ i5/i3 (codename: Whiskey Lake) and Celeron® processor. With the rise
AXIOMTEK’S ULTRA-SLIM 4K DIGITAL SIGNAGE PLAYER WITH DUAL DISPLAYS – DSP501-527 Read More »
Infineon Technologies AG has expanded its product offering for Battery Management System (BMS) with the TLE9012AQU a new sensing and balancing IC that is designed for batteries in hybrid and electric cars and other applications. It can measure the voltage in up to twelve battery cells with an accuracy of ± 5.8 mV over the entire temperature and voltage
BATTERY MANAGEMENT IC WITH UART INTERFACE FOR SENSING AND CELL BALANCING Read More »
The GLC-9000 Leakage Current Tester provides comprehensive testing for general purpose electric equipment. Saelig Company, Inc. has introduced the GWInstek GLC-9000 Leakage Current Tester performs leakage current (also called touch current) tests on general purpose electric (IEC 60990) equipment. This tester uses nine measurement device networks to simulate the human body interacting with equipment under test. Leakage current testing is needed to
GWINSTEK GLC-9000 LEAKAGE CURRENT TESTER Read More »
Eta Compute has launched an integrated, ultra-low-power AI Sensor Board, the ECM3532 AI Sensor Board, which has been designed for machine learning at the edge. [via] The board was developed to cut the initial phase of smart sensor development through its TENSAI SoC. The low power ECM3532 AI Sensor Board contains almost every function needed for
LOW-POWER AI SENSOR BOARD FOR MACHINE LEARNING AT THE EDGE Read More »
Lattice Semiconductor has introduced a new general-purpose FPGA family that has been developed to combine high I/O density, low-power, small packages and fast interfaces. [via] The Lattice Certus-NX series provides up to double the I/O density per mm 2 of similar FPGAs, and provides power savings, a small footprint, reliability, and instant-on performance. Devices in the family support
NEW LOW-POWER, GENERAL-PURPOSE LATTICE FPGA FAMILY Read More »
Direct Insight has introduced a QSMP Solder-down module featuring the STMicro ST32M1 single/dual core ARM Cortex-A7 processor. The module has been manufactured by the Direct Insight’s partner, Aachen-based Ka-Ro Electronics. [via] The SOM has been built around an ST32M1 family processor that is powered by a single or dual 650MHz ARM Cortex-A7 core, which is supported by
SOM PROVIDES ARM CORTEX-A7 PERFORMANCE IN QFN-STYLE PACKAGE Read More »
Salland Engineering delivers over 28 years of services to develop and build custom ATE instruments for the semiconductor industry. CEO, Paul van Ulsen said; Building high density instruments is always about finding the right balance between performance, density/throughput within the right available power and cooling at the right cost per channel. To address these challenges,
SE-DPIN: 16 TO 256 CHANNEL I/O CARD FOR PXIE AND ATE INSTRUMENTS Read More »
Your one-stop destination for PIC microcontroller projects, tutorials, PDFs, software, tools and everything embedded. Built for students, hobbyists & engineers.
PIC Microcontroller has been helping students and engineers since 2008 by providing high quality PIC projects and resources. We are passionate about embedded systems and microcontroller development.
© 2008 – 2026 PIC Microcontroller. All Rights Reserved.