Electronics News and Updates

Solar harvesting into Li ion battery

Solar harvesting into Li-ion battery

The AEMLION is a 0.8×0.6 inch (20x15mm) PCB with the AEM10941 Solar Harvesting IC from E-peas. It efficiently converts solar energy into Li-ion battery charge, it even works with indoor light. It features 3.3V and 1.8V regulated outputs that are enabled when the battery has useful charge and a low battery warning that informs the user of impending

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MALLEABLE MICRO – BATTERIES FOR WEARABLE TECHNOLOGY

MALLEABLE MICRO – BATTERIES FOR WEARABLE TECHNOLOGY

A new innovative technology for wearables is taking over the market of future technology. Wearables are portable systems that house sensors to make measurements from the wearer’s body. Powering these wearables requires flexible batteries that adapt to the specific material, and deliver the power needed for the system. Fraunhofer Institute for Reliability and Microintegration IZM developed

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VARISCITE RELEASES HEADLESS VERSION OF ITS LINUX FRIENDLY DART 6UL COM

VARISCITE RELEASES HEADLESS VERSION OF ITS LINUX-FRIENDLY DART-6UL COM

Variscite is releasing another pin-compatible version of their 50 x 25mm DART-6UL computer-on-module. This time it will be loaded with NXP’s headless new i.MX6 ULZ variant of the single Cortex-A7 core i.MX6 UL. This yet unnamed module lacks display or LAN support. It is described as “a native solution for headless Linux-based embedded products such as IoT devices and smart home

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SPACE LIMITATIONS ARE NO CONSTRAINT FOR AAEON’S LATEST IOT GATEWAY

SPACE LIMITATIONS ARE NO CONSTRAINT FOR AAEON’S LATEST IOT GATEWAY

(Taipei, Taiwan – October 4, 2018) – AAEON, a leading developer of advanced IoT solutions, releases the UPC-GWS01, the world’s smallest x86-based industrial computer. Just 91mm x 67mm x 55.2mm in size, the system is highly versatile and boasts onboard storage, WiFi, Bluetooth, and a comprehensive I/O interface. The UPC-GWS01, which has already won a Computex d&i Award,

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OCTAVO CREATES A 1GHZ COMPUTER THAT FITS INTO A 27X27MM SIP PACKAGE

OCTAVO CREATES A 1GHZ COMPUTER THAT FITS INTO A 27X27MM SIP PACKAGE

The OSD335x C-SiP System-in-Package (SiP) developed by Octavo, is a concept package that is modeled on its previous Sitara AM335x based SiP by including up to 16GB eMMC, an oscillator along with 1GB DDR3, PMIC, LDO, and EEPROM. The OSD335x C-SiP, is the most consolidated System-In-Package (SiP) module ever made. Modeled like its predecessors, the OSD335x C-SiP incorporates the Cortex-A8 based Texas

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