Summary of HIGH DENSITY ROBUST SSD OFFERS DENSITIES UP TO 1TB IN A 16×20 MM BGA
The Micron 2100AI/AT is a new industrial and automotive-grade SSD family featuring PCIe NVMe interfaces with 64-layer TLC 3D NAND. It offers densities up to 1TB in compact BGA (16x20mm) and M.2 form factors. Designed for aerospace, defense, and high-endurance applications, it includes features like namespace conversion to SLC mode, autonomous power transitions, and boot emulation to ensure ruggedness and reliability across extended temperature ranges.
Parts used in the Micron 2100AI/AT SSD:
- 64-layer triple-level cell (TLC) 3D NAND technology
- PCIe interface supporting NVMe protocol
- BGA form factor (16×20 mm)
- M.2 form factor
- Namespace feature for SLC mode conversion
- Autonomous power transitions capability
- Boot emulation support
- Extended temperature range components
- Data protection features
2100AI/AT SSD Family – High density robust SSD offers densities up to 1TB in a 16×20 mm BGA
Micron has officially launched the Micron 2100AI/AT– an industrial- and automotive-grade PCIe NVMe Industrial SSD family based on 64-layer triple-level cell (TLC) 3D NAND technology. Available in 64GB-1TB BGA and 256GB-1TB M.2 form factors, the new 2100AI/AT series is Micron’s first offering with a PCIe interface supporting the NVMe protocol that is designed to address the needs of the industrial segment: longevity, reliability, quality, ruggedness, and application-specific features such as namespace, autonomous power transitions, and boot emulation.
These SSDs are ideally suited for the Aerospace and Defence market combining an extended temperature range and robust data protection features, along with Micron’s long-term product commitment and customer collaboration, creates a design that stands apart from the competition.
Designs that require high endurance can take advantage of application-specific features provided by these PCIe NVMe SSDs, such as namespace. With the namespace feature, a portion of the SSD (or the entire SSD) can be converted to SLC mode.
In addition to having a removable M.2 form factor, the BGA form factor offers a highly ruggedized solution for industrial applications—providing up to 1TB of storage space. Systems requiring greater than 1TB can utilize multiples of these devices to take advantage of the 16mm x 20mm package size.
Read more: HIGH DENSITY ROBUST SSD OFFERS DENSITIES UP TO 1TB IN A 16×20 MM BGA
- What is the maximum storage density of the Micron 2100AI/AT?
The series offers densities up to 1TB in both BGA and M.2 form factors. - Can systems requiring more than 1TB utilize multiple devices?
Yes, systems can utilize multiples of these devices to achieve greater than 1TB capacity. - Does the 2100AI/AT support the NVMe protocol?
Yes, this is Micron's first offering with a PCIe interface supporting the NVMe protocol. - How does the namespace feature improve endurance?
The namespace feature allows a portion or the entire SSD to be converted to SLC mode for higher endurance. - Is the BGA form factor suitable for rugged industrial applications?
Yes, the BGA form factor provides a highly ruggedized solution for industrial applications. - What specific features address application-specific needs?
Features include namespace, autonomous power transitions, and boot emulation. - Which market segments are ideally suited for this SSD?
It is ideally suited for the Aerospace and Defence markets. - What type of NAND technology powers the 2100AI/AT?
It is based on 64-layer triple-level cell (TLC) 3D NAND technology.
