Vishay Intertechnology is broadening its optoelectronics portfolio with the introduction of two new automotive-grade high-speed silicon PIN photodiodes in top-view, surface-mount packages measuring 5 mm by 4 mm by 0.9 mm. Offering a large sensitive area of 7.5 mm2, the Vishay Semiconductors VEMD5010X01 and VEMD5110X01 provide high radiant sensitivity with a reverse light current of 48 µA and a very low dark current of 2 nA for automotive, industrial, and medical applications.
The AEC-Q101-qualified devices are manufactured using Vishay’s new foil assisted mold (FAM) technology. The photodiodes’ leadframe, bond wire, and connection pads are molded in a black epoxy, while a free cavity above the radiant sensitive area allows light to enter the package for signal generation. This design enables a smaller overall package size with a lower height profile, while maintaining a large radiant sensitive area. In addition, thermal stress on the bond is reduced for increased robustness and reliability.
For more detail: Vishay Intertechnology Automotive-Grade PIN Photodiodes Deliver 7.5 mm² Sensitive Area in Low-Profile Packages
