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THE NEW E VARIANTS OF INTEL TIGER LAKE LINEUP AND ADLINK CEXPRESS TL

THE NEW E VARIANTS OF INTEL TIGER LAKE LINEUP AND ADLINK CEXPRESS-TL

Intel has launched three embedded 11th gen, 10nm SuperFin fabricated Tiger Lake ULP3 “E” processors, keeping in mind the growing need for embedded applications. These new processors join with the earlier released nine Tiger Lake U-series ULP3 and lower-power Y-series ULP4 chips. Taking benefit from these new chips Adlink has now released a COM Express […]

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PORTWELL’S NEW COM EXPRESS TYPE 6 MODULE IS COMPACT COST EFFECTIVE WITH ACCELERATED GRAPHIC PROCESSING

PORTWELL’S NEW COM EXPRESS TYPE 6 MODULE IS COMPACT, COST-EFFECTIVE WITH ACCELERATED GRAPHIC PROCESSING

New MEDM-B603 features latest AMD embedded platform for medical imaging or multimedia imaging processing/control American Portwell Technology, Inc., (https://www.portwell.com), a leading COM Express solution provider for the embedded computing market, announces its new compact (125 x 95 mm) MEDM-B603 Type 6 COM Express module. MEDM-B603 features the AMD Ryzen™ Embedded V1000 SoC Accelerated Processing Unit

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