OPEN-Q 845 HDK DEVELOPMENT BOARD INTEGRATES SNAPDRAGON 845 SOC AND RUNS ANDROID 8.0
Intrinsyc’s new Open-Q 845 HDK Development Kit has the same Mini-ITX (170 x 170mm) dimensions and sandwich-style design as the Open-Q 835 from the previous year. The main SoC, Snapdragon 845 is integrated into the board topped by a heatsink. This dev board includes a smartphone like 5.7-inch QHD (1440 x 2560) touchscreen controlled via MIPI-DSI, as well as a camera board […]
OPEN-Q 845 HDK DEVELOPMENT BOARD INTEGRATES SNAPDRAGON 845 SOC AND RUNS ANDROID 8.0 Read More »
