processor

BOXER-6842: POWERING THE NEXT GENERATION OF EDGE AI

AAEON, an industry leader in embedded industrial computing, announces the BOXER-6842M, the latest solution in high performance industrial computing. Powered by the 8th and 9th Generation Intel® Core™ processors and supporting graphics cards up to 250W for video capturing applications, the BOXER-6842M is designed for the most intensive applications from Edge AI server to automated optical inspection (AOI). […]

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New microchip demonstrates efficiency and scalable design

Princeton University researchers have developed a new computer chip that promises to boost the performance of data centers that lie at the core of numerous online services such as email and social media. The chip — called “Piton” after the metal spikes driven by rock climbers into mountainsides to aid in their ascent — was presented Aug. 23

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Examining the environmental impact of computation and the future of green computing

when you think about your carbon footprint, what comes to mind? Driving and flying, probably. Perhaps home energy consumption or those daily Amazon deliveries. But what about watching Netflix or having Zoom meetings? Ever thought about the carbon footprint of the silicon chips inside your phone, smartwatch or the countless other devices inside your home?

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I.MX 8M PLUS-BASED SOM WITH INTEGRATED ARTIFICIAL INTELLIGENCE / MACHINE LEARNING (AI/ML)

Variscite, a global System on Module and embedded solutions provider, revealed its new System on Module (SoM) platforms based on the NXP i.MX 8M Plus processor. This is the first generation of SoM solution with dedicated Artificial Intelligence / Machine Learning (AI / ML) capabilities within an integrated NPU engine. Upcoming i.MX 8M Plus

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STEP INTO THE FUTURE WITH TRENTON SYSTEMS’ NEXT-GEN DUAL XEON® 3U BAM SERVER

Trenton Systems, a manufacturer of rugged servers, workstations, blade servers, JBOD storage systems, mini PCs, processor boards, and PCIe backplanes, is excited to announce the upcoming release of its most powerful rugged computer yet, the 3U BAM Server, featuring the company’s high-performance, next-gen, dual Intel® Xeon® SP motherboard. Scheduled for release in early 2021, the 3U

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AXIOMTEK’S LOW POWER COM EXPRESS TYPE 6 COMPACT MODULE WITH AMD RYZEN™ EMBEDDED V1000

Axiomtek – a world-renowned leader relentlessly devoted in the research, development and manufacture of series of innovative and reliable industrial computer products of high efficiency – is pleased to introduce the CEM130, its new COM Express Type 6 Compact module powered by the onboard AMD Ryzen™ Embedded V1000 processor with AMD Radeon™ RX Vega graphics for

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AVNET INTRODUCES 96BOARDS ON SEMICONDUCTOR DUAL CAMERA MEZZANINE FOR FAST PROTOTYPING

Global technology solutions provider, Avnet, introduced the 96Boards ON Semiconductor Dual Camera Mezzanine development and prototyping platform for the AP1302 imaging processor, coupled with dual imaging camera modules. According to the company, the platform will enable design and system engineers to create cost-effective embedded vision applications utilizing industry-standard technologies. The two Imager Access System (IAS) camera modules that ship standard on this Mezzanine use

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ESPRESSIF ANNOUNCES TWO NEW ESP32-S2 MINI MODULES

Espressif systems has announced ESP32-S2 MINI-1U with IPEX antenna and ESP32-S2-MIN-1 with a PCB antenna the breed of a newly branded ESP32-S2 WIFI modules part of Mini series modules. These are new additions to the catalog of Espressif systems which includes the ESP32-S2 Development boards, Espressif’s ESP32-S2 Wi-Fi Soc with future release of ESPS32-S3 and ESP32-C3 processors and much more both in

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ADVANTECH RELEASES HIGH-PERFORMANCE 3.5″ SBC MIO-5373 WITH 8TH GEN. INTEL® CORE™ PROCESSORS

Advantech, a leading global provider of IoT systems and embedded platforms, is pleased to announce the latest 3.5″ SBC MIO-5373 based on the low power 8th Gen. Intel Core SoC. Featuring compact 146 x 102 mm dimensions, the MIO-5373 design not only offers impressive I/O functionality but also provides domain-focused features like CANBus and wide-range power input. It is ideally

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FIRST COM-HPC AND NEXT-GEN COM EXPRESS

congatec fuels launch of 11th Gen Intel® Core™ processors with two great new design options In parallel with the 11th Gen Intel® Core™ processor launch (code named “Tiger Lake”), congatec – a leading vendor of embedded computing technology – announces the availability of both its first COM-HPC Client size A module and a next generation COM

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