hardware

XCOM – COMPACT EMBEDDED X86 PLATFORM FOR SDR AND OTHER APPLICATIONS

XCOM – COMPACT, EMBEDDED X86 PLATFORM FOR SDR AND OTHER APPLICATIONS

Designed To Support Unattended Operation, IP65+, And Passive Cooling Have you ever tried designing a truly embedded x86-based system? We have, and it was a journey full of unexpected pitfalls. Consider the importance of unattended operation, including resilience in the face of power failures and power voltage fluctuation. Need support for different CPU models? A […]

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WORLD’S LARGEST FPGA BOASTS 9 MILLION SYSTEM LOGIC CELLS

WORLD’S LARGEST FPGA BOASTS 9 MILLION SYSTEM LOGIC CELLS

Xilinx has expanded its 16nm Virtex UltraScale+ family to include what it claims to be the world’s largest FPGA, the Virtex UltraScale+ VU19P. By Julien Happich @ www.eenewseurope.com With 35 billion transistors, the VU19P provides the highest logic density and I/O count on a single device ever built, enabling emulation and prototyping of tomorrow’s most advanced

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EMTRION LAUNCHES A SBC BASED ON THE ST STM32MP1

EMTRION LAUNCHES A SBC BASED ON THE ST STM32MP1

STMicroelectronics, one of the leading semiconductor manufacturers, launched the STM32MP1 microprocessors series back in February 2019 which are based on an HSA (heterogeneous system architecture). The microprocessors are based on an Arm® Cortex®-A7 core running at 650 MHz and Cortex®-M4 at 209 MHz combined with a dedicated 3D graphics processing unit (GPU) and MIPI-DSI display interface and a CAN FD

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GREENLIANT DELIVERS ULTRA FAST SPEEDS WITH NVME M.2 ARMOURDRIVE SSDS

GREENLIANT DELIVERS ULTRA-FAST SPEEDS WITH NVME M.2 ARMOURDRIVE SSDS

Greenliant has started sampling its NVMe M.2 ArmourDrive™ solid state drive (SSD) modules to customers requiring high-performance, high-capacity removable data storage that can withstand extreme environments. The new industrial temperature (-40°C to +85°C) 88 PX Series NVMe M.2 ArmourDrive SSDs use 3-bits-per-cell (TLC) 3D NAND flash memory and are built in the widely used 2242 and

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TINY COMPUTE MODULES FEATURES SNAPDRAGON 845 AND SNAPDRAGON 660

TINY COMPUTE MODULES FEATURES SNAPDRAGON 845 AND SNAPDRAGON 660

A production ready micro SoM based on Snapdragon™ 845 SoC architected for Artificial Intelligence and Immersion The compact sized Inforce 67X1 SOM’s multiple MIPI-CSI interfaces and on-device artificial intelligence (AI) allows users to capture cinema-grade videos and blur the lines between physical and virtual worlds. The product’s enhanced hardware and software capabilities bring high-performance, true-to-life

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WEBFPGA RAPID FPGA DEVELOPMENT SYSTEM ON THE CLOUD

WEBFPGA: RAPID FPGA DEVELOPMENT SYSTEM ON THE CLOUD

WebUSB programmable FPGA development boards. Cloud-based synthesis. Until recently, FPGA development has suffered from a high barrier to entry for newcomers. In the past, development boards using Xilinx, Lattice, and Altera chipsets easily fetched $250-$2000 price tags. The hardware barrier has been all but eliminated by recent entrants, which include MojoBoard (https://alchitry.com/products/mojo-v3), the IceBreaker (https://www.crowdsupply.com/1bitsquared/icebreaker-fpga),

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ST RELEASES ROM BASED GNSS MODULE

ST RELEASES ROM-BASED GNSS MODULE

Designed for mass-market tracking and navigation applications, the Teseo-LIV3R ROM-based module, has full GNSSalgorithm capability for cost-conscious tracking and navigation devices, says ST Microelectronics. The GNSS module provides odometer functionality with three trip counters and reached-distance alert, along with geo-fencing capabilities with up to eight configurable circles and crossing-circles alarm. Support for real-time assisted GNSS with free server

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MEMS BASED “SONAR ON A SILICON CHIP” ULTRASONIC TIME OF FLIGHT SENSORS

MEMS-BASED “SONAR ON A SILICON CHIP” ULTRASONIC TIME-OF-FLIGHT SENSORS

TDK Corporation’s announces the immediate worldwide availability of the Chirp CH-101 MEMS-based ultrasonic Time-of-Flight (ToF) sensor. This ToF sensor utilizes a tiny ultrasonic transducer chip to send out a pulse of ultrasound and then listen for echoes returning from targets in the sensor’s field-of-view. By calculating the ToF, the sensor can determine the location of

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