News & Updates

XENON DEVELOPMENT KIT

XENON DEVELOPMENT KIT

Particle Industries endpoint and repeater development kit is designed for IoT projects and prototyping Particle’s Xenon is a powerful mesh-enabled development kit that can act as either an endpoint or repeater for Particle mesh networks. It is based on the Nordic nRF52840 and has built-in battery-charging circuitry so it is easy to connect a Li-Po and deploy a […]

XENON DEVELOPMENT KIT Read More »

EEZ BENCHBOX3

EEZ #BENCHBOX3

EEZ teams recently announced their latest project; the EEZ Bench Box 3 (BB3). The Bench Box 3 which is a FOSS and open hardware programmable power supply concept was designed to serve as a successor to EEZ’s H24005, with the aim of providing a power supply with better modularity, higher capacity, and functionality while preserving openness, and rich software

EEZ #BENCHBOX3 Read More »

INTRINSYC ANNOUNCES NEW PREMIUM TIER SYSTEM ON MODULE BASED ON QUALCOMM TECHNOLOGIES’ SDA845 SYSTEM ON CHIP

INTRINSYC ANNOUNCES NEW PREMIUM-TIER SYSTEM ON MODULE BASED ON QUALCOMM TECHNOLOGIES’ SDA845 SYSTEM ON CHIP

Designed for use in Advanced Robotics and Drones, Premium Camera Applications, Artificial Intelligence Platforms, and other Cutting-edge IoT Devices. Intrinsyc Technologies Corporation, a leading provider of solutions for the development and production of embedded and Internet of Things (IoT) products, today announced the Open-Q™ 845 µSOM (micro System on Module) and Development Kit, to be

INTRINSYC ANNOUNCES NEW PREMIUM-TIER SYSTEM ON MODULE BASED ON QUALCOMM TECHNOLOGIES’ SDA845 SYSTEM ON CHIP Read More »

TORADEX ANNOUNCES ITS APALIS SOM BASED ON THE NXP I.MX 8QUADMAX APPLICATIONS PROCESSOR

TORADEX ANNOUNCES ITS APALIS SOM BASED ON THE NXP I.MX 8QUADMAX APPLICATIONS PROCESSOR

Toradex, a leader in embedded computing, announced today general availability for its Apalis System on Module (SoM) based on the NXP® i.MX 8QuadMax applications processor. The SoM has been available as part of Toradex’s ‘early access’ program to its key partners and customers for several months and has a minimum product availability until 2030. The SoM is pin-compatible

TORADEX ANNOUNCES ITS APALIS SOM BASED ON THE NXP I.MX 8QUADMAX APPLICATIONS PROCESSOR Read More »

MICROCHIP SIMPLIFIES HARDWARE BASED IOT SECURITY

MICROCHIP SIMPLIFIES HARDWARE-BASED IOT SECURITY

A pre-provisioned solution that provides secure key storage for low-, mid- and high-volume device deployments using the ATECC608A secure element is now available from Microchip Technology. According to the company, the Trust Platform for its CryptoAuthentication family enables companies of all sizes to implement secure authentication. The platform consists of a three-tier offering, providing out-of-the-box

MICROCHIP SIMPLIFIES HARDWARE-BASED IOT SECURITY Read More »

3.5 INCH SBC WITH 8TH GEN INTEL® CORE™ PROCESSORS WHISKEY LAKE U

3.5-INCH SBC WITH 8TH GEN INTEL® CORE™ PROCESSORS (WHISKEY LAKE-U)

IBASE Technology, a global provider of Industrial motherboards and embedded computing solutions, reveals the IB919 3.5-inch single board computer based on 8th Generation Intel®  Core™ i7/i5/i3 and Celeron® 4000 processors (codenamed Whiskey Lake-U) built on a further refined 14nm++ manufacturing process, offering greater computing and graphics performance than the previous generation. IBASE expands its portfolio of long-term

3.5-INCH SBC WITH 8TH GEN INTEL® CORE™ PROCESSORS (WHISKEY LAKE-U) Read More »

PORTWELL’S NEW COM EXPRESS TYPE 6 MODULE IS COMPACT COST EFFECTIVE WITH ACCELERATED GRAPHIC PROCESSING

PORTWELL’S NEW COM EXPRESS TYPE 6 MODULE IS COMPACT, COST-EFFECTIVE WITH ACCELERATED GRAPHIC PROCESSING

New MEDM-B603 features latest AMD embedded platform for medical imaging or multimedia imaging processing/control American Portwell Technology, Inc., (https://www.portwell.com), a leading COM Express solution provider for the embedded computing market, announces its new compact (125 x 95 mm) MEDM-B603 Type 6 COM Express module. MEDM-B603 features the AMD Ryzen™ Embedded V1000 SoC Accelerated Processing Unit

PORTWELL’S NEW COM EXPRESS TYPE 6 MODULE IS COMPACT, COST-EFFECTIVE WITH ACCELERATED GRAPHIC PROCESSING Read More »

PIEZOLISTEN™ ULTRA THIN PIEZO SPEAKERS CONVERTS VIRTUALLY ANY SURFACE INTO A SPEAKER

PIEZOLISTEN™ ULTRA-THIN PIEZO SPEAKERS CONVERTS VIRTUALLY ANY SURFACE INTO A SPEAKER

TDK’s PiezoListen series of ultra-thin, high-power actuators convert virtually any surface into a speaker without compromising structural design. TDK’s PiezoListen ultra-thin piezo speakers balance design and functionality by allowing virtually any surface to be turned into a speaker. Unlike typical miniature speakers that tend to have a metallic sound, PiezoListen produces sound with dynamic range,

PIEZOLISTEN™ ULTRA-THIN PIEZO SPEAKERS CONVERTS VIRTUALLY ANY SURFACE INTO A SPEAKER Read More »

ULTRASOC ANNOUNCES NEXT GENERATION HARDWARE BASED CYBERSECURITY PRODUCTS

ULTRASOC ANNOUNCES NEXT-GENERATION HARDWARE-BASED CYBERSECURITY PRODUCTS

UltraSoC today announced next-generation hardware-based cybersecurity products that can be used to detect, block and record cyber-attacks in a broad range of applications – from vehicles and factory robots to consumer devices. Embedded monitors detect, block and record attacks, prevent propagation. UltraSoC today announced next-generation hardware-based cybersecurity products that can be used to detect, block and

ULTRASOC ANNOUNCES NEXT-GENERATION HARDWARE-BASED CYBERSECURITY PRODUCTS Read More »