technologies

U BLOX – ZERO COMPROMISES ON CELLULAR AND GNSS PERFORMANCE

U-BLOX – ZERO COMPROMISES ON CELLULAR AND GNSS PERFORMANCE

u-blox, a global provider of leading positioning and wireless communication technologies and services, has announced the ALEX-R5, a miniature cellular module that integrates low power wide area (LPWA) connectivity and global navigation satellite system (GNSS) technology into an ultra-small system-in-package (SiP) form factor. Comprising hardware components designed fully in-house, ALEX-R5 is based on the secure

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TDK INTRODUCES REVOLUTIONARY MEMS BASED CO2 GAS SENSOR PLATFORM

TDK INTRODUCES REVOLUTIONARY MEMS-BASED CO2 GAS SENSOR PLATFORM

TDK Corporation announces the InvenSense TCE-11101, a miniaturized ultra-low-power MEMS gas sensor platform for direct and accurate detection of CO2 in-home, automotive, IoT, healthcare, and other applications. The TCE-11101 introduces new technology that expands TDK’s sensor leadership into new applications and solutions, as part of the new SmartEnviroTM family. Its small size and low power enable consumer and commercial devices of

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TYPE 1LV – LOWEST POWER WIFI BLUETOOTH MODULE OPENS NEW APPLICATIONS

TYPE 1LV – LOWEST POWER WIFI/BLUETOOTH MODULE OPENS NEW APPLICATIONS

In IEEE 802.11ac-friendly mode, the WLAN operation supports MCS8 (256 QAM) in 20MHz channel for data rate up to 78Mbps. The CYW43012 implements highly sophisticated enhanced collaborative coexistence hardware mechanisms and algorighms, which ensure that WLAN and Bluetooth collaboration is optimized for maximum performance. Teaming with Cypress allows us to leverage our combined expertise in delivering breakthrough solutions

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A MINIATURE MICROFLUIDICS HEAT SINK FOR HIGH PERFORMANCE CHIP COOLING

A MINIATURE MICROFLUIDICS HEAT SINK FOR HIGH-PERFORMANCE CHIP COOLING

At the Embedded World Conference 2019, imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents a silicon-based compact microchannel heat sink that enables high heat flux dissipation. The imec heat sink assembled to a high performance chip for cooling the latter one achieves a low total thermal resistance of 0,34K/W to 0.28K/W at

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INTEL OPTANE INTEL’S NEXT GENERATION SSD TECHNOLOGY 2

INTEL OPTANE, INTEL’S NEXT-GENERATION SSD TECHNOLOGY

In July 2015, Intel and Micron Technology announced a new technology for memory and storage solutions called “3D XPoint™ technology“. It is a new category of nonvolatile memory that addresses the need for high-performance, high-endurance, and high-capacity memory and storage. Now Intel had produced its Optane™ technology that provides an unparalleled combination of high throughput, low latency, high quality of service, and high endurance. The new technology

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