OCTAVO CREATES A 1GHZ COMPUTER THAT FITS INTO A 27X27MM SIP PACKAGE
The OSD335x C-SiP System-in-Package (SiP) developed by Octavo, is a concept package that is modeled on its previous Sitara AM335x based SiP by including up to 16GB eMMC, an oscillator along with 1GB DDR3, PMIC, LDO, and EEPROM. The OSD335x C-SiP, is the most consolidated System-In-Package (SiP) module ever made. Modeled like its predecessors, the OSD335x C-SiP incorporates the Cortex-A8 based Texas […]
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