processor

ULTRA COMPACT NEW AMPLICON DINRAIL PC

ULTRA-COMPACT NEW AMPLICON DINRAIL PC

DINrail-mountable Impact-P series are ultra-compact 4.7” x 2.2” x 3.8” Intel® ATOM™-based embedded PCs: low-current, 9-36V operation, fanless design, customizable, with long life cycle. Saelig Company, Inc. (www.saelig.com) announces what is probably the smallest industrial embedded PC in the marketplace, the Amplicon Impact-P Series. These rugged PCs feature the Intel® Apollo Lake ATOM™ E3900 generation processors, supported by high bandwidth […]

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AXIOMTEK’S QUAD VIEW 3.5” EMBEDDED BOARD WITH AMD RYZEN™ EMBEDDED V1807B V1605B PROCESSOR – CAPA13R

AXIOMTEK’S QUAD-VIEW 3.5” EMBEDDED BOARD WITH AMD RYZEN™ EMBEDDED V1807B/V1605B PROCESSOR – CAPA13R

Axiomtek – a world-renowned leader relentlessly devoted in the research, development and manufacture of series of innovative and reliable industrial computer products of high efficiency – is pleased to introduce the CAPA13R, a high-performance 3.5” embedded board with quad displays. The CAPA13R is powered by the onboard AMD RYZEN™ Embedded V1807B/V1605B processor with AMD Radeon™ RX

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AMD RYZEN BASED CONGATEC COM EXPRESS MODULE FOR THE INDUSTRIAL TEMPERATURE RANGE

AMD RYZEN BASED CONGATEC COM EXPRESS MODULE FOR THE INDUSTRIAL TEMPERATURE RANGE

congatec – a leading vendor of embedded computing technology – introduces its new conga-TR4 COM Express Type 6 module with AMD Ryzen Embedded V1000 Series processors for the industrial temperature range from -40°C to +85°C. It is available with optional burn-in & cold-soak stress screening services for the highest reliability. The most demanding graphics and

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ADVANTECH RELEASES HIGH PERFORMANCE 3.5” SBC MIO 5373 WITH 8TH GEN. INTEL® CORE™ PROCESSORS

ADVANTECH RELEASES HIGH-PERFORMANCE 3.5” SBC MIO-5373 WITH 8TH GEN. INTEL® CORE™ PROCESSORS

Advantech (2395.TW), a leading global provider of IoT systems and embedded platforms, is pleased to announce the latest 3.5” SBC MIO-5373 based on the 8th Gen. Intel Core platform with low-power SoC. Featuring compact 146 x 102mm dimensions, the MIO-5373 design not only offers impressive I/O functionality but also provides domain-focused features like CANBus and

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NORDIC’S NRF52832 WL CSP SOC PROVIDES PROCESSING POWER AND MULTIPROTOCOL SUPPORT FOR TUNDRA LABS’ TL448K6D VR MODULE

NORDIC’S NRF52832 WL-CSP SOC PROVIDES PROCESSING POWER AND MULTIPROTOCOL SUPPORT FOR TUNDRA LABS’ TL448K6D-VR MODULE

Nordic Semiconductor today announces that Tundra Labs, a Green Bay, WI-based technology company, has selected Nordic’s nRF52832 multiprotocol System-on-Chip (SoC) for its ‘TL448K6D-VR module’. The TL448K6D-VR module assists developers to simplify and lower the cost of designing six-degrees-of-freedom (6DoF) tracked devices for Valve’s SteamVR gaming platform. The highly integrated module employs the 3.0 by 3.2mm

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AXIOMTEK’S HIGH PERFORMANCE FANLESS EMBEDDED SYSTEM WITH FRONT ACCESSIBLE DESIGN – EBOX640 521 FL

AXIOMTEK’S HIGH-PERFORMANCE FANLESS EMBEDDED SYSTEM WITH FRONT-ACCESSIBLE DESIGN – EBOX640-521-FL

Axiomtek – a world-renowned leader relentlessly devoted in the research, development and manufacture of series of innovative and reliable industrial computer products of high efficiency – is pleased to announce the eBOX640-521-FL, its new high-performance fanless embedded system powered by the 8th generation Intel® Core™ i7/i5/i3 and Celeron® processor with the Intel® H310 chipset (codename: Coffee Lake).

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