WORLD’S FIRST INDUSTRIAL GRADE ESIM IN MINIATURIZED PACKAGE

WORLD’S FIRST INDUSTRIAL-GRADE ESIM IN MINIATURIZED PACKAGE

Machine-to-machine communication in the Internet of Things (IoT) requires reliable data collection and uninterrupted data transmission. For taking full advantage of the ubiquitous mobile networks, Infineon Technologies AG provides the world’s first industrial-grade embedded SIM (eSIM) in a miniature Wafer-level Chip-scale Package (WLCSP). Manufacturers of industrial machines and equipment ranging from vending machines to remote […]

WORLD’S FIRST INDUSTRIAL-GRADE ESIM IN MINIATURIZED PACKAGE Read More »