Liquid Cooling Moves onto the Chip for Denser Electronics

Liquid Cooling Moves onto the Chip for Denser Electronics

Using microfluidic passages cut directly into the backsides of production field-programmable gate array (FPGA) devices, Georgia Institute of Technology researchers are putting liquid cooling right where it’s needed the most – a few hundred microns away from where the transistors are operating. Georgia Tech graduate student Tom Sarvey is shown with test equipment used to […]

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