ICECOOL β AN INTRA-CHIP COOLING SYSTEM THAT IS MORE EFFICIENT
n theΒ Mooreβs LawΒ race to keep improving computer performance, the IT industry has turned upward, stacking chips like nano-sized 3D skyscrapers.Β But those stacks have their limits, due to overheating.Β Researchers fromΒ IBMΒ have solved this problem by developing anΒ intra-chip cooling systemΒ as a contribution toΒ ICECoolprogram research project by theΒ DARPAΒ (Defense Advanced Research Projects Agency). Today, chips are typically cooled by fans […]
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