Infineon Technologies AG introduced the new IGBT7 chip for its well-known Easy housing platform in March. Now it is taking the state-of-the-art TRENCHSTOP™ IGBT7 to the arena of medium power: in the standard industry package EconoDUAL™ 3. In this chip technology, the 1200 V module provides a leading nominal current of 900 A enabling a […]
ECONODUAL™ 3 WITH TRENCHSTOP™ IGBT7 FOR AN UNMATCHED 900 A POWER RATING Read More »
Programmable, low-noise, three-channel power supplies that deliver up to 375W in a compact 2U high, half-rack-wide enclosure have been introduced by Tektronix. The Keithley Series 2230G is designed for maximum flexibility, accuracy, and low noise when testing high power, multi-voltage circuits such as LED drivers, automotive, and power-IC circuits. The power supplies’ three channels are isolated,
THREE-CHANNEL POWER SUPPLIES DELIVER UP TO 375W Read More »
Nexperia announced the market’s fastest common mode filter (choke)/ ESD protection combination. The new PCMFxUSB3BA/C features the industry’s widest differential passband of up to 10 GHz 3 dB frequency and very high surge robustness of up to 7.5 A 8/ 20 µs. It is designed to suppress common mode and single-ended noise while minimizing the
Three Linear Triple Output Power Supplies launched by Global Specialties feature have fully programmable isolated outputs that can be adjusted independently or combined in series or parallel for higher voltage or current. Each model offers variable voltage and current on two channels, with the third channel output rated at 6V & 5A. Each front panel
TRIPLE OUTPUT POWER SUPPLIES FEATURE EXCELLENT LOAD Read More »
AAEON, an industry leader in factory AI and Edge Computing solutions, announces the latest product in the UP line of products, the UP Xtreme board and UP Xtreme Edge embedded system, also called UPX Edge. With the power of the 8th Generation Intel® Core™ processors, the UP Xtreme is built to power industrial automation, robotics, AI, and IoT applications. The
PUSH PERFORMANCE TO THE EDGE WITH UP XTREME FROM AAEON Read More »
SEGGER just released Ozone V3.10, a major update to its full-featured graphical debugger and performance analyzer. The new release includes support for custom instructions, allowing disassembly of application-specific instructions added to the CPU core to tailor it for the particular application. Custom instructions are defined in plug-in scripts, which can be easily edited by the user of Ozone or
SEGGER’S OZONE DEBUGGER ADDS SUPPORT FOR CUSTOM INSTRUCTIONS Read More »
UnitedSiC has developed silicon carbide transistors in standard packages with the world’s lowest on resistance. Chris Dries, CEO, talks to Nick Flaherty about the significance of the move. UnitedSiC has launched four silicon carbide SiC transistors with the world’s lowest on resistance RDS(on) to open up new applications. “What we are doing is pretty incredible
DRIVING DOWN THE ON RESISTANCE OF SILICON CARBIDE TRANSISTORS Read More »
Displays are an important part of any device in today’s world and while several advancements have been made in their quality with improved resolution and low power features, almost little has changed when it comes to the complexity involved with creating beautiful user interfaces for devices. This is why the team at STONE created the STVC035WT-01 intelligent Smart display.
DESIGN CUSTOM UI WITH STONE TECH INTELLIGENT TFT LCD MODULE Read More »
Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, is now stocking the MOD_CH101 ultrasonic time-of-flight (ToF) sensor module and DK-CH101 SmartSonic™ platform from InvenSense, a TDK Group company. The ToF solutions offer fast and accurate range measurement with ultra-low power consumption, and are capable of detecting objects of any
TDK INVENSENSE MOD-CH101 ULTRASONIC TOF SENSOR MODULE Read More »
Advantech, a leading global provider of intelligent IoT systems and embedded platforms, is pleased to announce MIO-2361, the latest Pico-ITX single board computer designed with onboard LPDDR4-2400 & 32G eMMC powered by Intel® Atom™ E3900 series/Pentium® N4200/Celeron® N3350 processors. The rugged design of the MIO-2361 means typical memory (socket type) assemblies are not used. The MIO-2361 offers deep power
RUGGED PICO-ITX MIO-2361 SBC FEATURING ONBOARD LPDDR4 & EMMC Read More »
