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ICECOOL – AN INTRA CHIP COOLING SYSTEM THAT IS MORE EFFICIENT

ICECOOL – AN INTRA-CHIP COOLING SYSTEM THAT IS MORE EFFICIENT

n the Moore’s Law race to keep improving computer performance, the IT industry has turned upward, stacking chips like nano-sized 3D skyscrapers. But those stacks have their limits, due to overheating. Researchers from IBM have solved this problem by developing an intra-chip cooling system as a contribution to ICECoolprogram research project by the DARPA (Defense Advanced Research Projects Agency). Today, chips are typically cooled by fans

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