News & Updates - PIC Microcontroller

U-BLOX LAUNCHES FIRST WI-FI 6 MODULE SERIES IN AUTOMOTIVE GRADE

Driving new user experiences in automotive infotainment thanks to concurrent dual Wi‑Fi support and Bluetooth 5.1. u‑blox, a global provider of leading positioning and communication technologies, has announced the JODY‑W3 series, multiradio modules featuring Wi‑Fi 6 with 2 x 2 MIMO and dual‑mode Bluetooth 5.1. Supporting the latest IEEE 802.11ax standard, also known as Wi‑Fi 6, […]

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WD RELEASES MOBILE INAND UFS SERIES EMBEDDED FLASH DRIVES, READY FOR 5G

Western Digital released its new Western Digital iNAND MC EU521, an embedded Universal Flash Storage (UFS) device. Western Digital is a supporter of EDEC’s implementation of WriteBooster under the UFS 3.1 standard that global handset makers will support for smartphones optimized for 5G applications and capabilities, according to the company. The iNAND MC EU311, MC EU511

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SAELIG INTRODUCES RBD 9103 USB GRAPHING PICOAMMETER

This programmable current logger can measure bipolar picoamps to milliamps, with unique features such as 5kV DC voltage isolation. Saelig Company, Inc. announces the availability of the RBD 9103 USB Graphing Picoammeter, a compact, versatile, general-purpose picoammeter designed to accurately measure DC current from nanoamps to milliamps via its isolated BNC input. This rugged, portable, and affordable

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PRESSURE TRANSDUCER SERIES FROM MERIT SENSOR

The TR pcb mountable pressure transducer series from Merit SensorTM is a rugged, direct-media pressure monitoring solution designed for today’s toughest pressure sensing environments. This pressure transducer series offers a pressure range from 15psi to 500psi with a fully compensated amplified output. The TR series from Merit SensorTM is designed for air, liquid and gas harsh media

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WINSYSTEMS UNVEILS FANLESS IP65-RATED PANEL PC FOR RUGGED OPERATING ENVIRONMENTS

Truly Industrial, Highly Reliable PPC12-427 Panel PC Solution Withstands Shock, Vibration, Dust And Low-Pressure Wash Downs; Provides Abundant Connectivity And Added Security In A Low-Profile Design Embedded computing pioneer WINSYSTEMS today introduced its multitouch, feature-packed PPC12-427 rugged display platform with an IP65-rated sealed front bezel and gasket for mounting in an enclosure. Based on the Intel E3950 processor, it

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AMBIENT HUMIDITY ENERGY HARVESTERS COULD COMPETE WITH SOLAR CELLS

Leveraging the natural adsorption–desorption exchange of water molecules from ambient air at the interface of a nanoporous mesh of protein nanowires, a team of researchers from the University of Massachusetts has demonstrated a durable form of energy harvesting that could potentially compete with solar cells on volumetric power density. By Julien Happich @ eenewseurope.com Publishing their

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SONOS ACQUIRES THE DATA-OVER-SOUND PIONEER, CHIRP

The recent moves by Sonos can only be explained as targets towards expanding its connected ecosystem of smart devices and beyond. The wireless speaker company from Santa Barbara California, sometime last year acquired a French company that provides embedded assistants and interfaces for devices that run locally and offline. Of recent, the company set out to add to

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OSM (OPEN STANDARD MODULE) WITH NXP I.MX 8M MINI / NANO CPU

F&S Elektronik Systeme GmbH presents a prototype of a direct solder module. It’a a 30 x 30mm “OSM-MX8MM” module that runs Linux on an i.MX8M Mini. As part of the SGET, the standardization group SDT.05 was founded jointly by iesy GmbH, F&S Elektronik Systeme GmbH and Kontron AG. The aim of this group is a new standard

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COOLSIC™ MOSFET 650 V FAMILY OFFERS BEST RELIABILITY AND PERFORMANCE TO EVEN MORE APPLICATIONS

Infineon Technologies AG continues to expand its comprehensive silicon carbide (SiC) product portfolio with 650 V devices. With the newly launched CoolSiC™ MOSFETs Infineon is addressing the growing demand for energy efficiency, power density, and robustness in a wide range of applications. Amongst them are server, telecom and industrial SMPS, solar energy systems, energy storage and battery formation, UPS, motor

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TI’S EMI-OPTIMIZED INTEGRATED TRANSFORMER TECHNOLOGY MINIATURIZES ISOLATED POWER TRANSFER INTO IC-SIZED PACKAGING

Engineers can shrink their power solution by as much as 80% and maximize efficiency in high-voltage industrial applications with a new high-density, isolated DC/DC bias power supply. Texas Instruments (TI) introduced the first integrated circuit (IC) developed with a new proprietary integrated transformer technology: a 500-mW high-efficiency isolated DC/DC converter with the industry’s lowest electromagnetic interference (EMI), the UCC12050.

TI’S EMI-OPTIMIZED INTEGRATED TRANSFORMER TECHNOLOGY MINIATURIZES ISOLATED POWER TRANSFER INTO IC-SIZED PACKAGING Read More »