News & Updates

SINGLE ENDED 2 CHANNEL GAN CLASS D AMPLIFIER – EVALUATION BOARD

SINGLE-ENDED, 2-CHANNEL GAN CLASS D AMPLIFIER – EVALUATION BOARD

The EVAL_AUDAMP24 e-mode GaN HEMT-based evaluation board from Infineon Technologies is a 2-channel, 225W/ch (4Ω at ±43V) or 250 W/ch (8Ω at ±63V) half-bridge class D audio power amplifier for high-end Hi-Fi audio systems. This evaluation board demonstrates how to use the IGT40R070D1 E8220 CoolGaN™ gallium nitride transistor together with the MERUS™ IRS20957SPBF controller IC, implement protection circuits, and

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AURORA MB E PAPER IS AN INTELLIGENT MONOCHROME E PAPER DISPLAY

AURORA MB E-PAPER IS AN INTELLIGENT MONOCHROME E-PAPER DISPLAY

Pervasive Displays’ intelligent monochrome e-paper with integrated timing controller, SPI, and 140 dpi glare-free display Pervasive Displays’ e-paper technology offers a high level of readability under a wide range of lighting conditions. This Aurora Mb 1.54 inch monochrome display has an outline of 37.32 mm x 31.80 mm and is 1.10 mm thick, providing a square

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NEW DC DC CONVERTERS OFFER 50 PERCENT SMALLER FOOTPRINT

NEW DC/DC CONVERTERS OFFER 50 PERCENT SMALLER FOOTPRINT

Murata unveiled the MYWGC series from the MonoBK™ DC/DC converter family. The new point-of-load (POL) modules offer a 50-percent smaller footprint than competing solutions and set new standards in size, efficiency and performance. The highly integrated, multi-output DC/DC converters leverage Murata’s core technology advantages in power module development, advanced 3D integrated packaging and passive component

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NXP ANNOUNCES GENERAL AVAILABILITY OF THE ARM CORTEX M33 BASED LPC551X S1X MCU FAMILY

NXP ANNOUNCES GENERAL AVAILABILITY OF THE ARM CORTEX-M33-BASED LPC551X/S1X MCU FAMILY

NXP Semiconductors today announced the availability of its LPC551x/S1x microcontroller (MCU) family – further extending its performance-efficient LPC5500 MCU series. The LPC551x/S1x MCU family offers developers low power consumption, embedded security, pin-, software- and peripheral-compatibility to accelerate time-to-market. The LPC551x/S1x family leverages ultra-efficient 40-nm flash technology for cost and performance benefits. Key features include: Over 600 EEMBC® CoreMarks®

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THE NEW BLYST840 PACKS A SURPRISING AMOUNT OF IOT HARDWARE INTO ITS TINY FINGERTIP SIZE

THE NEW BLYST840 PACKS A SURPRISING AMOUNT OF IOT HARDWARE INTO ITS TINY, FINGERTIP SIZE

BLYST Nano is a tiny ARM Cortex Module with Bluetooth and 30 I/O, but next product BLYST840 is a finger-tip size, 32-bit ARM Cortex-M4F module with Bluetooth 5 and 46 I/O; a powerful upgrade of a system on a module indeed. Built around the Nordic nRF52832 Bluetooth SOC and the powerful 64MHz ARM cortex- M4Fprocessor, the new

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AMD RYZEN BASED CONGATEC COM EXPRESS MODULE FOR THE INDUSTRIAL TEMPERATURE RANGE

AMD RYZEN BASED CONGATEC COM EXPRESS MODULE FOR THE INDUSTRIAL TEMPERATURE RANGE

congatec – a leading vendor of embedded computing technology – introduces its new conga-TR4 COM Express Type 6 module with AMD Ryzen Embedded V1000 Series processors for the industrial temperature range from -40°C to +85°C. It is available with optional burn-in & cold-soak stress screening services for the highest reliability. The most demanding graphics and

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ADVANTECH RELEASES HIGH PERFORMANCE 3.5” SBC MIO 5373 WITH 8TH GEN. INTEL® CORE™ PROCESSORS

ADVANTECH RELEASES HIGH-PERFORMANCE 3.5” SBC MIO-5373 WITH 8TH GEN. INTEL® CORE™ PROCESSORS

Advantech (2395.TW), a leading global provider of IoT systems and embedded platforms, is pleased to announce the latest 3.5” SBC MIO-5373 based on the 8th Gen. Intel Core platform with low-power SoC. Featuring compact 146 x 102mm dimensions, the MIO-5373 design not only offers impressive I/O functionality but also provides domain-focused features like CANBus and

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