REAL3™ TIME-OF-FLIGHT IMAGE SENSOR: FOURTH GENERATION WITH HVGA RESOLUTION
Infineon Technologies AG is presenting the fourth generation of its REAL3™ image sensor IRS2771C at Mobile World Congress 2019 in Barcelona, Spain. The 3D Time-of-Flight (ToF) single chip is especially designed to meet the requirements of the mobile consumer device market and, in particular, demand for higher resolutions with small lenses. The wide range of use cases includes secure […]
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