PARKER EXPANDS THERMAL INTERFACE MATERIALS OFFERING

Summary of PARKER EXPANDS THERMAL INTERFACE MATERIALS OFFERING


The Chomerics division of Parker Hannifin launched THERM-A-GAP GEL 75, a single-component, dispensable gel thermal interface material with 7.5 W/m-K thermal conductivity. It offers low compression force, minimal stress on components, and nearly three times the flow rate of the next THERM-A-GAP family material. Designed for high-volume automated production, it targets telecommunications, automotive safety electronics, power supplies, and memory/power modules, and is positioned as a more automation-friendly alternative to thermal gap pads.

Parts used in the THERM-A-GAP GEL 75 Project:

  • THERM-A-GAP GEL 75 (7.5 W/m-K single component dispensable thermal interface material)
  • Gel dispensing systems for automated application
  • Heat-generating electronic components (general application targets)
  • Automated production equipment for high-volume manufacturing
  • Telecommunications equipment (as application examples)
  • Automotive safety electronics modules (as application examples)
  • Power supplies (as application examples)
  • Memory and power modules (as application examples)

The Chomerics division of Parker Hannifin Corporation, the global leader in motion and control technologies, announced the launch of THERM-A-GAP GEL 75, a 7.5 W/m-K single component dispensable thermal interface material designed for high-performance applications.

PARKER EXPANDS THERMAL INTERFACE MATERIALS OFFERING

THERM-A-GAP GEL 75 is a single component, gel material best suited for today’s high-powered electronics applications. When applied to a heat-generating component, THERM-A-GAP GEL 75 provides minimal stress and pressure due to its low compression force and represents the highest thermal conductivity dispensable available from Parker Chomerics. Its flow rate is nearly 3x faster than the next closest performing material in the THERM-A-GAP family.

THERM-A-GAP GEL 75 is best suited for high volume, automated production, specifically found in telecommunications equipment, automotive safety electronics modules, power supplies, and memory and power modules.

The opportunity for automation is a significant advantage for THERM-A-GAP GEL 75 over thermal gap pads because gel dispensing systems allow for the support of multiple size and thickness requirements with a single system configuration. While thermal gap pad placement can be automated to an extent, the equipment and fixturing required to do so is typically quite specialized and may not be readily adapted from one job to another.

“GEL 75 was formulated to accommodate the future high-power demands of many different markets, including 5G enabled telecom infrastructure, automotive applications — any application that is seeing increased bandwidth demands that generate excessive heat.”

Read more: PARKER EXPANDS THERMAL INTERFACE MATERIALS OFFERING

Quick Solutions to Questions related to THERM-A-GAP GEL 75:

  • What is THERM-A-GAP GEL 75?
    It is a 7.5 W/m-K single component dispensable gel thermal interface material from Parker Chomerics.
  • What performance advantage does GEL 75 offer?
    It provides the highest thermal conductivity dispensable available from Parker Chomerics and has nearly 3x the flow rate of the next closest THERM-A-GAP material.
  • Is GEL 75 suitable for automated production?
    Yes, it is best suited for high-volume, automated production using gel dispensing systems.
  • Why is GEL 75 preferred over thermal gap pads for automation?
    Because gel dispensing systems support multiple size and thickness requirements with a single configuration, while thermal gap pad automation requires more specialized equipment and fixturing.
  • What types of applications is GEL 75 intended for?
    It is intended for telecommunications equipment, automotive safety electronics modules, power supplies, and memory and power modules.
  • Does GEL 75 reduce mechanical stress on components?
    Yes, its low compression force provides minimal stress and pressure on heat-generating components.
  • What markets drove the formulation of GEL 75?
    Markets with future high-power demands, including 5G enabled telecom infrastructure and automotive applications experiencing increased bandwidth demands.
  • Can one dispensing system handle different sizes and thicknesses with GEL 75?
    Yes, gel dispensing systems allow support of multiple size and thickness requirements with a single system configuration.

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