Summary of LED Matrix Backpack
The author created a carrier board for a 2-inch 5×7 LED matrix to facilitate serial communication and improve double-sided PCB fabrication skills. The project utilizes a PIC16F737 microcontroller, transistors, and various connectors to support RS232 and I2C protocols. Assembly challenges included soldering vias with resistors, handling small 0603 capacitors, and placing the display before the connectors.
Parts used in LED Matrix Backpack:
- 2 inch 5x7 LED matrix
- PIC16F737 microcontroller
- Transistors
- Data connectors
- RS232 connector
- I2C connector
- Power and ICSP pins connector
- 14 pin machine pin sockets
- Switches
- 0603 capacitors
- Resistors (used as via conductors)
- Press 'n' peel blue material
I had purchased some huge (2″) 5×7 matrix a while ago, as part of my led sensor research. They’ve basically been banging around the lab since, getting pins bent and such. So this past weekend, I decided to put them to some other use. Their pin layout is sort of weird, it doesn’t match up with a breadboard at all (one of the reasons they never made it into the led research). So, I decided to make up some back-packs for them, or is it a carrier board? Anyway, the board features one 5×7 matrix, one pic 16f737, a few transistors and some data connectors. The board provides two means of serial communication; asynchronous rs232 at 19200 bps, or synchronous i2c at 100kbps. A second connector provides power and ICSP pins.
This project has no practical application as of yet. The main reason I made it was to improve on my double-sided pcb fab techniques. This time I found using point to point traces instead of a large “pour” made things work a lot smoother. I used the ‘sandwich’ method with press ‘n’ peel blue. Roughly 1.5 min per side.
One thing I had to keep in mind while doing this layout was accessibility to solder both sides, since I can’t through plate my own vias. So things had to be laid down in specific order. I soldered the vias first, using some cheap resistors with very fine leads as my conductors. The method involved sticking the resistor into the via, with just a bit poking out the other side, then bending the resistor 90 degrees and holding it to the board. Then a quick dab of solder onto each joint set them in place. Next, straighten out the resistor leads, and trim them off. Another quick few dabs with the soldering iron and each one was fully connected. Next came the smt parts. The switches were rather easy, but those blasted little 0603 capacitors always give me grief. I tin both pads, then apply a bit more flux as “glue”, then try to reheat one of the pads, to reflow the solder onto the part. It works great with 0805 and larger parts, but the little 0603 usually gets sucked onto the tip of the iron by the surface tension of the solder.
One hard choice I had to make was whether to solder the chip straight into the board, or use a socket. I opted for a socket, which meant a harder time soldering the “top” layer. Luckily, I was able to dig up some 14 pin machine pin sockets, and thanks to the machine pin itself, they stand proud of the board a little, just enough to sneak in with the soldering iron.
For whatever reason, I decided to solder the led display next, leaving the connectors for last. I partly wanted to see which side of the board the connectors would look better on… I think next revision, they’re going on the bottom. During assembly of the connectors, I nicked the display a couple times with the iron, oh well!
Right now, the display is flashing my initials. Oh, here is the schematic, nothing exciting really!
For more detail: LED Matrix Backpack
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Why did the author create this carrier board?
The main reason was to improve double-sided PCB fab techniques and utilize a large LED matrix that previously had incompatible pin layouts. -
What communication methods does the board support?
The board provides asynchronous RS232 at 19200 bps or synchronous I2C at 100kbps. -
How were the vias soldered without through-plating?
The author used cheap resistors with fine leads as conductors by sticking them into the vias, bending them, and soldering the joints. -
What method was used for fabricating the double-sided PCB?
The sandwich method with press 'n' peel blue was used, taking roughly 1.5 minutes per side, utilizing point-to-point traces instead of a large pour. -
What challenge was faced when soldering 0603 capacitors?
Surface tension often caused the tiny capacitors to get sucked onto the tip of the soldering iron instead of staying on the pads. -
Why was a socket chosen for the microcontroller chip?
A socket was selected despite making top-layer soldering harder because it allowed the machine pin to stand proud enough to sneak in the soldering iron. -
In what order were components assembled?
Vias were soldered first, followed by SMT parts like switches and capacitors, then the LED display, and finally the connectors.
