thermal

VPC 3350AI FASTER PERFORMANCE FOR AI AT THE EDGE

VPC-3350AI: FASTER PERFORMANCE FOR AI AT THE EDGE

AAEON, a leader in AI and edge computing solutions, announces the VPC-3350AI embedded PC featuring Intel® Movidius® Myriad™ X. Built for industrial and in-vehicle use, the VPC-3350AI provides faster and smoother AI processing compared to similar systems which rely on CPU performance alone. The VPC-3350AI is based on a flexible platform powered by Intel® Atom™ x5 E3940 (formerly Apollo

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ADVANTECH LAUNCHES HIGH PERFORMANCE COM EXPRESS SOM 5899

ADVANTECH LAUNCHES HIGH-PERFORMANCE COM EXPRESS SOM-5899

Advantech, a world leader in embedded IoT, is pleased to announce the launch of its high-end SOM-5899 series COM Express Type 6 Module designed with 8th and 9th Gen Intel® Core™ H-series processors. Compared with previous generations, the SOM-5899 is enhanced with six cores for better multithreaded performance in compute-intensive applications. With a dual channel 96GB ECC and non-ECC

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MITSUBISHI ELECTRIC TO LAUNCH MELDIR THERMAL DIODE INFRARED SENSOR

MITSUBISHI ELECTRIC TO LAUNCH MELDIR THERMAL DIODE INFRARED SENSOR

Accurately detects heat to identify types of heat sources and specific human behavior Mitsubishi Electric Corporation announced that it will launch the Mitsubishi Electric Diode InfraRed sensor (MelDIR), a thermal sensor for applications in the fields of security, heating, ventilation and air conditioning (HVAC) and smart buildings, on November 1. MelDIR accurately distinguishes between humans and

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QIANLI LC IRP01 THERMAL VISIBLE MICROSCOPE FOR PCB REPAIR

QIANLI LC-IRP01 THERMAL/VISIBLE MICROSCOPE FOR PCB REPAIR

The QianLi’s 160×120 thermal imaging sensor and 1920×1080 visible sensor combine to make a powerful circuit board repair tool, especially helpful in finding overheating or short-circuit issues. Saelig Co. Inc. has introduced the QianLi LC-IRP01 Thermal Imaging Camera, a diagnostic tool for PCBs which displays heat images to help identify damaged or malfunctioning components or short-circuits. 

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HIGH THERMAL RESOLUTION HIGH FRAME RATE LOW COST THERMAL INSPECTION CAMERA

HIGH THERMAL RESOLUTION, HIGH FRAME RATE, LOW COST THERMAL INSPECTION CAMERA

The Fotric 326 provides high quality radiometric images full of detailed thermal information in a handheld pistol-grip camera for investigative analysis Saelig Company, Inc. (www.saelig.com) has introduced the FOTRIC 326 Thermal Imaging Camera – a rugged, durable, accurate, and portable handheld heat investigation device, designed for a wide range of equipment and infrastructure thermal diagnostic tasks.  The 326

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LED ENGIN LUXIGEN™ LZ7 SIX DIE LED DELIVERS SIX COLORS

LED ENGIN LUXIGEN™ LZ7 SIX-DIE LED DELIVERS SIX COLORS

LED Engin LuxiGen™ LZ7 Six-Die LED delivers six colors from a single 7mm2 package. Designed for stage, studio, and special effect lighting, the LuxiGen LZ7 adds PC Phosphor Converted (PC) Amber, Cyan, and PC Lime to the traditional Red, Blue, Green (RGB) LED color set, enabling richer and wider color combinations for more sophisticated color mixing. The compact 3.4mm

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OURPCB PUBLISHED A NEW ARTICLE “HOW TO CHOOSE PCB SUBSTRATE MATERIAL”

OURPCB PUBLISHED A NEW ARTICLE: “HOW TO CHOOSE PCB SUBSTRATE MATERIAL”

SHIJIAZHUANG, China, July 11, 2019 (Newswire.com) –OurPCB, a multi-national PCB Manufacturing, and PCB Assembly company, The publication is available on the https://www.ourpcb.com/pcb-substrate-material.html section of the company’s website for free. It has six chapters that cover every detail about PCB Substrate Material. Among the key subjects on PCB Substrate Material include: Copper Foil Requirements: This section gives a brief overview of

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LM5164 – 6V TO 100V INPUT 1 A SYNCHRONOUS BUCK DC DC CONVERTER WITH ULTRA LOW

LM5164 – 6V TO 100V INPUT, 1-A SYNCHRONOUS BUCK DC-DC CONVERTER WITH ULTRA-LOW

The LM5164 synchronous buck converter is designed to regulate over a wide input voltage range, minimizing the need for external surge suppression components. A minimum controllable on-time of 50 ns facilitates large step-down conversion ratios, enabling the direct step-down from a 48-V nominal input to low-voltage rails for reduced system complexity and solution cost. The LM5164 operates during input

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X FAB INTRODUCES HIGHLY SENSITIVE SPAD AND APD DEVICES BASED ON ITS MODULAR 180NM PROCESS TECHNOLOGY

X-FAB INTRODUCES HIGHLY-SENSITIVE SPAD AND APD DEVICES BASED ON ITS MODULAR 180NM PROCESS TECHNOLOGY

X-FAB Silicon Foundries, the leading analog/mixed-signal and specialty foundry, continues to develop ground-breaking semiconductor solutions to address the most difficult of design challenges. It has now announced the availability of avalanche photodiode (APD) and single-photon avalanche diode (SPAD) products for implementation in scenarios where there are extremely low light conditions to contend with and augmented

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