Summary of STMICROELECTRONICS EVALUATION BOARDS TO BOOST THE G3-PLC HYBRID CONNECTIVITY INTO SMART DEVICES
STMicroelectronics released Evaluation Boards for its ST8500 programmable PLC modem, enhancing G3-PLC Hybrid connectivity for smart-grid and IoT devices. The ST8500 is a high-performance SoC with an ARM Cortex-M4F (up to 200 MHz) that can run PLC protocols up to 500 kHz. The G3-PLC Hybrid enables devices to use both powerline and RF (IEEE 802.15.4, 6LoWPAN, IPv6) and dynamically select the best channel, embedding RF Mesh support at PHY and data-link layers to combine powerline and wireless mesh strengths.
Parts used in the ST8500 Evaluation Boards Project:
- ST8500 programmable power-line communication (PLC) modem system-on-chip
- ARM 32-bit Cortex-M4F core (integrated in ST8500)
- Evaluation Boards from STMicroelectronics
- G3-PLC Hybrid protocol stack (software component)
- Support for IEEE 802.15.4 (RF standard)
- Support for 6LoWPAN (networking protocol)
- Support for IPv6 (networking protocol)
- Powerline physical medium (PLC up to 500 kHz)
- Wireless RF mesh medium
A couple of weeks back STMicroelectronics announced its new addition to the development ecosystem for its ST8500 programmable power-line communication (PLC) modem chipset – STMicroelectronics Evaluation Boards. For those new to the connectivity of smart-grid and IoT devices, G3-PLC Hybrid is a:
standard that offers extended capabilities for smart grid and IoT applications in one seamlessly managed network over both wired and wireless media
ST8500 is a high-performance, programmable power-line communication (PLC) modem system-on-chip that has the capability to run any PLC protocol in the frequency band up to 500 kHz. This system-on-chip is integrated with the ARM 32-bit Cortex-M4F core clocked up at 200 MHz maximum frequency.
G3-PLC hybrid is different in terms of how each device in the mesh network can use PLC as well as RF for communication. This allows several systems with ST8500 system-on-chip to “select the powerline or wireless channel autonomously and change dynamically to ensure the most reliable connection”.
ST’s hybrid protocol stack is based on G3-PLC, IEEE 802.15.4, 6LowPAN and IPv6 open standards. By embedding support for RF Mesh in the physical (PHY) and data-link layers, the ST8500 combines the strengths of powerline and wireless mesh networks for communication between smart nodes and data collectors.
Read more: STMICROELECTRONICS EVALUATION BOARDS TO BOOST THE G3-PLC HYBRID CONNECTIVITY INTO SMART DEVICES
- What is the ST8500?
The ST8500 is a high-performance, programmable power-line communication modem system-on-chip with an integrated ARM 32-bit Cortex-M4F core. - What frequency band can ST8500 run PLC protocols in?
ST8500 can run PLC protocols in the frequency band up to 500 kHz. - What core does the ST8500 integrate and what is its maximum clock?
It integrates an ARM 32-bit Cortex-M4F core clocked up at 200 MHz maximum. - What is G3-PLC Hybrid?
G3-PLC Hybrid is a standard offering extended capabilities for smart grid and IoT applications over both wired and wireless media in one managed network. - How does G3-PLC Hybrid improve connectivity?
Devices can autonomously select powerline or wireless channels and change dynamically to ensure the most reliable connection. - Which standards form the basis of ST’s hybrid protocol stack?
ST’s hybrid protocol stack is based on G3-PLC, IEEE 802.15.4, 6LoWPAN and IPv6 open standards. - Where is RF Mesh support embedded in the ST8500 solution?
RF Mesh support is embedded in the physical (PHY) and data-link layers. - What do the Evaluation Boards provide for the ST8500 ecosystem?
The Evaluation Boards boost G3-PLC Hybrid connectivity into smart devices by supporting development and integration with the ST8500.
