Hot rods keep the die cool

Quad Flatpack No leads (QFN) packages offer at least one advantage over Ball Grid Array (BGA) packages: because the electrical connections are partly made via solder lands on the side of the component visual inspection of solder joints and repairing them is easier. Thermally enhancing a package for power applications can be done with a heat conducting pad underneath, but this makes visual inspection difficult. Fortunately other solutions exist.

Hot rods keep the die cool

Texas Instruments’ HotRod QFN is a thermally enhanced plastic package with solder lands on all sides as well as power buses for enhanced current carrying capability. Inside the package the die is mounted on a copper lead frame which eliminates the power wire bonds, improving electrical and thermal performance. This technique also improves application efficiency and minimizes package parasitic radiation.

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About The Author

Ibrar Ayyub

I am an experienced technical writer holding a Master's degree in computer science from BZU Multan, Pakistan University. With a background spanning various industries, particularly in home automation and engineering, I have honed my skills in crafting clear and concise content. Proficient in leveraging infographics and diagrams, I strive to simplify complex concepts for readers. My strength lies in thorough research and presenting information in a structured and logical format.

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