A little while ago, we covered a positioning receiver IC that enhanced positioning accuracy to centimeters due mostly to its cutting-edge capability of concurrent reception of multiple constellation data (GPS, GLONASS, BeiDou, and QZSSl, to be precise). Its name is the Teseo-LIV3F, from ST Microelectronics, and you can check the article link below, which I recommend […]
Smaller is better when it comes to microchips, researchers said, and by using 3D components on a standardized 2D microchip manufacturing platform, developers can use up to 100 times less chip space. A team of engineers has boosted the performance of its previously developed 3D inductor technology by adding as much as three orders of
RESEARCHERS EXPAND MICROCHIP CAPABILITY WITH NEW 3D INDUCTOR TECHNOLOGY Read More »
Multi-band GNSS receiver delivers centimeter level accuracy in seconds. The ZED-F9P positioning module features the new u-blox F9 receiver platform, which provides multi-band GNSS to high volume industrial applications in a compact form factor. ZED-F9P is a multi-band GNSS module with integrated u-blox multi-band RTK technology for centimeter-level accuracy. The module enables precise navigation and automation of moving industrial machinery by
ZED-F9P MODULE – U-BLOX F9 HIGH PRECISION GNSS MODULE Read More »
