A little while ago, we covered a positioning receiver IC that enhanced positioning accuracy to centimeters due mostly to its cutting-edge capability of concurrent reception of multiple constellation data (GPS, GLONASS, BeiDou, and QZSSl, to be precise). Its name is the Teseo-LIV3F, from ST Microelectronics, and you can check the article link below, which I recommend …
Smaller is better when it comes to microchips, researchers said, and by using 3D components on a standardized 2D microchip manufacturing platform, developers can use up to 100 times less chip space. A team of engineers has boosted the performance of its previously developed 3D inductor technology by adding as much as three orders of …
RESEARCHERS EXPAND MICROCHIP CAPABILITY WITH NEW 3D INDUCTOR TECHNOLOGY Continue Reading
Multi-band GNSS receiver delivers centimeter level accuracy in seconds. The ZED-F9P positioning module features the new u-blox F9 receiver platform, which provides multi-band GNSS to high volume industrial applications in a compact form factor. ZED-F9P is a multi-band GNSS module with integrated u-blox multi-band RTK technology for centimeter-level accuracy. The module enables precise navigation and automation of moving industrial machinery by …
ZED-F9P MODULE – U-BLOX F9 HIGH PRECISION GNSS MODULE Continue Reading
