DSP Group, a leading global provider of wireless and voice-processing chipset solutions has introduced a low-power AI/ML-enabled dual-core SoC called DBM10.
According to the CEO of the company, almost all edge applications for AI require the ultimate as regards low power, small form factor, cost effectiveness, and fast time-to-market. So it’s with great enthusiasm that they bring DBM10 to the desk of their customers and partners.
Our team has worked to make the absolute best use of available processing power and memory for low-power AI and ML at the edge—including developing our own patent-pending weight compression scheme—while also emphasizing ease of deployment. We look forward to seeing how creatively developers apply the DBM10 platform.
DBM10 AI SoC is a high-performance and low power chip with Digital Signal Processor and dedicated nNetLite Neural Network Engine. It is designed to improve voice and sensor processing and also ensure that consumption is low when working with sufficient-sized neural networks.
DBM10 is supported by an embedded memory along with serial and audio interfaces that make it easily compatible with many external devices, including application processor, codecs, microphones, and sensors. It is well suited for wearables, tablets, smartphones, true wireless stereo headsets and smart home gadgets like remote controls.